1. Mounted with minimum recommended pad size, PC Board FR4.
Symbol
R
qJL
R
qJA
Value
14
125
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 2)
(i
F
= 3.0 A, T
J
= 25°C)
(i
F
= 3.0 A, T
J
= 150°C)
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, T
J
= 25°C)
(Rated DC Voltage, T
J
= 150°C)
Maximum Reverse Recovery Time
(i
F
= 1.0 A, di/dt = 50 A/ms)
(i
F
= 0.5 A, i
R
= 1.0 A, I
R
to 0.25 A)
Maximum Forward Recovery Time
(i
F
= 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
v
2.0%.
Symbol
v
F
Typ
−
0.83
−
95
Max
1.25
1.05
3.0
150
75
50
50
Unit
V
i
R
mA
t
rr
ns
t
fr
ns
TYPICAL CHARACTERISTICS
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
10
150°C
1
10
150°C
1
125°C
25°C
125°C
25°C
0.1
0.1
0.01
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0.01
0.3 0.4 0.5 0.6
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
I
r
, REVERSE CURRENT (mA)
150°C
0.01
125°C
0.001
0.0001
25°C
I
r
, REVERSE CURRENT (mA)
0.1
1
Figure 2. Maximum Forward Voltage
0.1
0.01
0.001
150°C
125°C
0.00001
0.000001
0.0001
0.00001
25°C
0
100
200
300
400
500
600
0
100
200
300
400
500
600
V
r
, REVERSE VOLTAGE (V)
V
r
, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
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2
Figure 4. Maximum Reverse Current
MURS360BT3
TYPICAL CHARACTERISTICS
70
60
C, CAPACITANCE (pF)
50
40
30
20
10
0
0
20
40
60
80
100
T
J
= 25°C
f = 1 MHz
I
F(AV)
, AVERAGE FORWARD CUR-
RENT (A)
5
4
Square
3
2
1
0
dc
65
75
85
95
105
115
125
135
145 155
V
r
, REVERSE VOLTAGE (V)
T
C
, CASE TEMPERATURE (°C)
Figure 5. Typical Capacitance
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
3
R
qJA
= 71°C/W
dc
2
dc
1
Square Wave
R
qJA
= 120°C/W
No Heatsink
P
F(AV)
, AVERAGE POWER DISSIPA-
TION (W)
4
Figure 6. Current Derating, Lead
T
J
= 150°C
3
Square Wave
dc
2
1
0
0
25
50
75
100
125
150
0
0
1
2
3
4
T
A
, AMBIENT TEMPERATURE (°C)
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Figure 7. Current Derating, Ambient
4
P
F(AV)
, AVERAGE POWER DISSIPA-
TION (W)
T
J
= 150°C
3
Figure 8. Typical Forward Power Dissipation
Square Wave
dc
2
1
0
0
1
2
3
4
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Figure 9. Maximum Forward Power
Dissipation
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3
MURS360BT3
100
50% Duty Cycle
10
R(t) (°C/W)
20%
10%
5%
2%
1
1%
0.1
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (s)
1
10
100
1000
Figure 10. Thermal Response, Junction−to−Ambient
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4
MURS360BT3
PACKAGE DIMENSIONS
SMB
DO−214AA
CASE 403A−03
ISSUE H
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.20
2.28
0.10
0.19
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.087
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.090
0.007
0.087
0.012
0.156
0.181
0.220
0.063
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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