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BSP52T1G_12

Description
NPN Small-Signal Darlington Transistor
File Size91KB,4 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet View All

BSP52T1G_12 Overview

NPN Small-Signal Darlington Transistor

BSP52T1G, BSP52T3G
NPN Small-Signal
Darlington Transistor
This NPN small signal Darlington transistor is designed for use in
switching applications, such as print hammer, relay, solenoid and lamp
drivers. The device is housed in the SOT-223 package, which is
designed for medium power surface mount applications.
Features
http://onsemi.com
The SOT-223 Package can be soldered using wave or reflow. The
formed leads absorb thermal stress during soldering, eliminating the
possibility of damage to the die
Available in 12 mm Tape and Reel
Use BSP52T1 to Order the 7 Inch/1000 Unit Reel
PNP Complement is BSP62T1
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T
C
= 25°C unless otherwise noted)
Rating
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current
Total Power Dissipation (Note 1)
@ T
A
= 25°C
Derate above 25°C
Total Power Dissipation (Note 2)
@ T
A
= 25°C
Derate above 25°C
Operating and Storage
Temperature Range
Symbol
V
CES
V
CBO
V
EBO
I
C
P
D
Max
80
90
5.0
1.0
0.8
6.4
1.25
10
−65
to 150
Unit
V
V
V
A
W
mW/°C
W
mW/°C
°C
MEDIUM POWER
NPN SILICON
SURFACE MOUNT
DARLINGTON TRANSISTOR
COLLECTOR 2,4
BASE
1
EMITTER 3
4
1
2
MARKING DIAGRAM
3
SOT−223
CASE 318E
STYLE 1
AYW
AS3G
G
P
D
T
J
, T
stg
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance (Note 1)
Junction-to-Ambient
Thermal Resistance (Note 2)
Junction-to-Ambient
Maximum Temperature for Soldering
Purposes
Time in Solder Bath
Symbol
R
qJA
R
qJA
Value
156
100
Unit
°C/W
°C/W
A
= Assembly Location
Y
= Year
W
= Work Week
AS3
= Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BSP52T1G
BSP52T3G
Package
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
Shipping
1000 / Tape & Reel
4000 / Tape & Reel
T
L
260
10
°C
Sec
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum
recommended footprint.
2. Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm
2
pad.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2012
January, 2012
Rev. 8
1
Publication Order Number:
BSP52T1/D
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