Y5CA5111P
TECHNICAL DATA
Visible LED 5 mm, AlGaInP
Features
•
•
•
•
•
•
High Luminous LEDs
5mm Round Standard Directivity
Long Lifetime Operation
Superior Weather-resistance
UV Resistant Epoxy
Water Clear Type
Diretivity:
Applications
•
•
•
•
•
•
Signage and Channel Letter
Decorating and Entertainment Lighting
Architectural Lighting
Outdoor/Indoor Application
Back Lighting
Other Lighting
Outline Dimension:
Absolute Maximum Ratings (T
a
=25°C)
Item
Power Dissipation
Forward Current
Pulse Forward Current *
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (5 sec.)
Symbol
P
D
I
F
I
FP
V
R
T
opr
T
stg
T
sol
Value
182
70
120
5
-30 … +85
-40 … +100
260
Unit
mW
mA
mA
V
°C
°C
°C
PIN
1
2
Function
LED Anode
LED Cathode
Unit: mm
Tolerance: ±0.3 mm
* pulse width max. 10 ms, duty ratio max. 1/10
Specifications (T
a
=25°C)
Item
Optical Specifications
Luminous Intensity *
1
Dominant Wavelength
Viewing Angle
Electrical Specifications
Forward Voltage
Reverse Voltage
1
Condition
I
F
= 70 mA
I
F
= 70 mA
I
F
= 70 mA
I
F
= 70 mA
U
F
= 5 V
Symbol
I
V
λ
D
2Θ
1/2
U
F
U
R
Min.
40000
585
-
2.0
-
Typ.
55000
590
15
2.3
-
Max.
-
595
-
2.6
10
Unit
mcd
nm
deg
V
µA
* Tolerance of chromaticity coordinates is ±10%
2
* Tolerance of luminous intensity is ±15%
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Reliability Test Report
Classification
Test Time
Operation Life
High Temerature
High Humidity
Storage
High Temerature Storage
Low Temperature Storage
Temperature Cycling
Thermal Shock
Solder Resistance
Solderability
Test Condition
I
F
= 70 mA
T
a
= 25 ±5 °C
Test Time = 1000hrs (-24hrs, +72hrs)
R.H = 90~95%
T
a
= 65 ±5 °C
Test Time = 240hrs (+2hrs)
T
a
= 105 ±5 °C
Test Time = 500hrs (-24 hrs, +48hrs)
T
a
= 55 ±5 °C
Test Time = 500hrs (-24hrs, +48hrs)
105 °C ~ 25 °C ~ 55 °C ~ 25 °C
60 min 10 min 60 min 10 min
20 cycles
105 °C ~ -55 °C
10 min 10 min
10 cycles
T
a
= 260 ±5 °C
Test Time = 10 ±1 sec
T
a
= 230 ±5 °C
Test Time = 5 ±1 sec
Endurance Test
Environmental Test
Judgement Criteria Of Falure For The Reliability
Measuring Time
Luminous Intensity
Forward Voltage
Reverse Current
Symbol
I
V
U
F
I
R
Conditions
I
F
= 70 mA
I
F
= 70 mA
U
F
= 5 V
Failure
I
V
< 0.5*Initial Value
U
F
< 1.2*Initial Value
I
R
> 2*Spec
Operation Life Test Luminance Rate Curve
* Brun-in condition: 50 mA
* Projection of Statistical Average Light Output Degradation Performance for LED Technology Extrapolated from Test Data.
* According to outgoing Packaged Products Specification
* MTBF:100,000hrs, 90% Confidence (A Failure is Any LED Which is Open, shorted or fails to Emit Light)
* The Projected Data is Base on The Feature of LED Itself Under Normal Operation Conditions.
* Any Improper Circuit Design or External Factors Might Cause a Different Result.
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Precaution for Use
1. Cautions
•
DO NOT look directly into the light or look through the optical system.
2. Lead Forming
•
When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
•
Lead forming should be done before soldering.
•
DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
•
When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads,
it causes deterioration of the lead and it will degrade the LEDs.
3. Soldering Conditions
•
Solder the LEDs no closer than 3 mm from the base of the lead.
•
Recommended soldering conditions:
Pre-Heat
Pre-Heat Time
Solder Bath Temperature
Dipping Time
Dipping Position
Dip Soldering
120 °C Max.
60 Seconds Max.
260 °C Max.
5 Seconds Max.
No lower than 3 mm from the base of the epoxy bulb
•
•
•
•
•
DO NOT apply any stress to the lead particularly when heat.
The LEDs must not be reposition after soldering.
After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
4. Static Electricity
•
The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
•
All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
5. Heat Generation
•
The powered LEDs generate heat. Heat dissipation should be considered in the application
design to avoid the environmental conditions for operation in excess of the absolute
maximum ratings.
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Analog electronics
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