IMX8
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
•
•
•
•
Epitaxial Planar Die Construction
Complementary PNP Type Available (IMT4)
Small Surface Mount Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device, Note 4 and 5
A
B
2
B
1
E
1
SOT-26
Dim
A
B C
Min
0.35
1.50
2.70
⎯
⎯
2.90
0.013
1.00
0.35
0.10
0°
Max
0.50
1.70
3.00
⎯
⎯
3.10
0.10
1.30
0.55
0.20
8°
Typ
0.38
1.60
2.80
0.95
0.55
3.00
0.05
1.10
0.40
0.15
⎯
B
C
D
F
H
M
Mechanical Data
•
•
Case: SOT-26
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
Marking Information: KX8, See Page 3
Ordering & Date Code Information: See Page 3
Weight: 0.016 grams (approximate)
K
C
2
E
2
C
1
H
J
K
L
M
α
•
•
•
•
•
•
•
J
D
B
2
B
1
E
1
F
L
All Dimensions in mm
C
2
E
2
C
1
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
d
R
θ
JA
T
j
, T
STG
Value
120
120
5.0
50
300
417
-55 to +150
Unit
V
V
V
mA
mW
°C/W
°C
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Electrical Characteristics
Characteristic
OFF CHARACTERISTICS (Note 2)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
ON CHARACTERISTICS (Note 2)
DC Current Gain
Collector-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product
Notes:
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
h
FE
V
CE(SAT)
f
T
Min
120
120
5.0
⎯
⎯
180
⎯
⎯
Typ
⎯
⎯
⎯
⎯
⎯
⎯
⎯
140
Max
⎯
⎯
⎯
0.5
0.5
820
0.5
⎯
Unit
V
V
V
μA
μA
⎯
V
MHz
I
C
= 50μA
I
C
= 1.0mA
I
E
= 50μA
V
CB
= 100V
V
EB
= 4.0V
I
C
= 2.0mA, V
CE
= 6.0V
I
C
= 10mA, I
B
= 1.0mA
V
CE
= 12V, I
C
= 2.0mA,
f = 100MHz
Test Condition
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30304 Rev. 8 - 2
1 of 3
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IMX8
© Diodes Incorporated
600
350
P
D
, POWER DISSIPATION (mW)
300
250
200
150
100
50
0
0
25
50
75 100 125 150 175
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 1, Max Power Dissipation vs.
Ambient Temperature
T
A
= 25
°
C
T
A
= 75
°
C
500
h
FE
, DC CURRENT GAIN
400
T
A
= 25
°
C
300
T
A
= -25
°
C
200
100
200
0
1.0
100
10.0
I
C,
COLLECTOR CURRENT (mA)
Fig. 2 Typical DC Current Gain vs. Collector Current
100
I
C
, COLLECTOR CURRENT (mA)
1.0
V
CE(SAT)
, COLLECTOR TO EMITTER
SATURATION VOLTAGE (V)
10.0
T
A
= 75
°
C
T
A
= 150
°
C
0.100
T
A
= 25
°
C
1.0
T
A
= -25
°
C
T
A
= -50
°
C
0.1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
V
BE(ON)
, BASE-EMITTER VOLTAGE (V)
Fig. 3 Typical Collector Current vs.
Base-Emitter Voltage
0.9
0.010
1
10
100
1,000
I
C
, COLLECTOR CURRENT (mA)
Fig. 4 Typical Collector-Emitter Voltage
vs. Collector Current
1,000
V
CE
= 5 Volts
6
I
B
= 16µA
f
T
, GAIN BANDWIDTH PRODUCT (MHz)
I
C
, COLLECTOR CURRENT (mA)
5
I
B
= 14µA
100
4
I
B
= 12µA
I
B
= 10µA
3
I
B
= 8µA
10
2
I
B
= 6µA
I
B
= 4µA
1
1
1
0
10
I
C
, COLLECTOR CURRENT (mA)
Fig. 5 Typical Gain Bandwidth Product
vs. Collector Current
100
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V
CE
, COLLECTOR-EMITTER VOLTAGE (V)
Fig. 6 Typical Collector Current vs.
Collector-Emitter Voltage
DS30304 Rev. 8 - 2
2 of 3
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IMX8
© Diodes Incorporated
Ordering Information
(Note 5 & 6 )
Device
IMX8-7-F
Notes:
Packaging
SOT-26
Shipping
3000/Tape & Reel
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KX8 = Product Type Marking Code
YM = Date Code Marking
Y =Year ex: T = 2006
M = Month ex: 9 = September
KX8
Date Code Key
Year
Code
Month
Code
2002
N
Jan
1
2003
P
Feb
2
2004
R
Mar
3
2005
S
Apr
4
2006
T
May
5
Jun
6
YM
2007
U
Jul
7
2008
V
Aug
8
2009
W
Sep
9
2010
X
Oct
O
2011
Y
Nov
N
2012
Z
Dec
D
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
DS30304 Rev. 8 - 2
3 of 3
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IMX8
© Diodes Incorporated
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