Green
ES3A/AB - ES3D/DB
3.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
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Glass Passivated Die Construction
Super-Fast Recovery Time For High Efficiency
Surge Overload Rating to 100A Peak
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
Mechanical Data
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•
•
•
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Case: SMB/SMC
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
SMB Weight: 0.093 grams (approximate)
SMC Weight: 0.21 grams (approximate)
Top View
Bottom View
Ordering Information
(Note 3)
Part Number
ES3x-13-F
ES3xB-13-F
Notes:
Case
SMC
SMB
Packaging
3000/Tape & Reel
3000/Tape & Reel
* x = Device type, e.g. ES3A-13-F (SMC package); ES3AB-13-F (SMB package).
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
YWW
ES3x(B)
ES3x = Product type marking code, ex: ES3A (SMC package)
ES3xB = Product type marking code, ex: ES3AB (SMB package)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
WW = Week code (01 to 53)
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
1 of 4
www.diodes.com
November 2010
© Diodes Incorporated
ES3A/AB - ES3D/DB
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 4)
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 100°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
ES3A/AB
50
35
ES3B/BB
100
70
3.0
100
ES3C/CB
150
105
ES3D/DB
200
140
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Typical Thermal Resistance, Junction to Terminal
Typical Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Symbol
R
θ
JT
R
θ
JA
T
J,
T
STG
Value
10
50
-55 to +150
Unit
°C/W
°C
°C
Electrical Characteristics
Characteristic
Maximum Forward Voltage
Peak Reverse Current
at Rated DC Blocking Voltage (Note 4)
@T
A
= 25°C unless otherwise specified
Symbol
@ I
F
= 3.0A
@ T
A
= 25°C
@ T
A
= 125°C
V
FM
I
RM
t
rr
C
T
Value
0.9
10
500
25
45
Unit
V
μA
ns
pF
Maximum Reverse Recovery Time (Note 6)
Typical Total Capacitance (Note 7)
Notes:
4. Short duration pulse test used to minimize self-heating effect.
5. Unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pads as heat sink.
6. Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See Figure 5.
7. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
I
O
, AVERAGE RECTIFIED CURRENT (A)
Note 3
3
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
4
10
1.0
2
0.1
1
0
25
100
50
75
125
150
T
T
, TERMINAL TEMPERATURE (
°
C)
Fig. 1 Forward Current Derating Curve
175
0.01
0
0.4
0.8
1.2
1.6
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
2 of 4
www.diodes.com
November 2010
© Diodes Incorporated
ES3A/AB - ES3D/DB
I
R
, INSTANTANEOUS REVERSE CURRENT (µA)
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
120
Single Half-Sine-Wave
1,000
100
T
J
= 125
°
C
80
100
60
40
10
T
J
= 25
°
C
20
0
1
1.0
0
40
80
120
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 4 Typical Reverse Characteristics
10
NUMBER OF CYCLES AT 60Hz
Fig. 3 Surge Current Derating Curve
100
Fig. 5 Reverse Recovery Time Characteristic and Test Circuit
Package Outline Dimensions
B
SMB
Dim
Min
Max
A
3.30
3.94
B
4.06
4.57
C
1.96
2.21
D
0.15
0.31
E
5.00
5.59
G
0.05
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
SMC
Dim
Min
Max
A
5.59
6.22
B
6.60
7.11
C
2.75
3.18
D
0.15
0.31
E
7.75
8.13
G
0.10
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
A
C
D
J
H
G
E
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
3 of 4
www.diodes.com
November 2010
© Diodes Incorporated
ES3A/AB - ES3D/DB
Suggested Pad Layout
SMB
Value (in mm)
Dimensions
Z
6.7
G
1.8
X
2.3
Y
2.5
C
4.3
SMC
Value (in mm)
Dimensions
Z
9.3
G
4.4
X
3.3
Y
2.5
C
6.8
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
ES3A/AB - ES3D/DB
Document number: DS14003 Rev. 15 - 2
4 of 4
www.diodes.com
November 2010
© Diodes Incorporated
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