^For symbol “U” termination add .20 inches (0.51mm) to the positive length tolerance and .015 inches (0.38mm) to the positive width and thickness tolerances.
Ordering Information
03028
DSCC Drawing
Number
03028 (0603 case size)
BX
Dielectric
BR
BX
104
Capacitance
Code (pF)
2 Sig. Digits +
Number of
Zeros
Y
Voltage
W = 6.3V
X = 10V
Y = 16V
Z = 25V
A = 50V
B = 100V
C = 200V
J
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
Z
End
Metallization^
U = SnPb (4% min)
Z = SnPb (4% min)
C
Group C
Testing Option
Blank = No group C testing
C = Full group C
L = 2,000 hour life test only
M = 1,000 hour life test only
H = Low voltage humidity only
7189
Packaging/Grade
(C-Spec)*
Blank = Waffle Pack
7189 = 7” Reel
^ “U” = Base metallization-barrier metal-solder coated (tin/lead alloy, with a min of 4% lead). Melting point is +200ºC or less. Metallization thickness is
≥
60μ-inches.
^ “Z” = Base metallization-barrier metal-tinned (tin/lead alloy, with a min of 4% lead).
* Additional reeling or packaging options may be available. Contact KEMET for details.
Additional termination options may be available. Contact KEMET for details.
Continuing from the previous post, NAND Gate Design - [Altera SoC] - Electronic Engineering World - Forum [url=https://bbs.eeworld.com.cn/thread-498198-1-1.html]https://bbs.eeworld.com.cn/thread-49819...
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