BZD27C SERIES
800mW Surface Mount Zener Diodes
Features
·
Sillicon planar zener diodes.
·
Low profile surface-mount package.
·
Zener and surge current specification
·
Low leakage current
·
Excellent stability
·
High temperature soldering guaranteed:
265℃/10 seconds, at terminals
M
L
K
B
C
H
A
Mechanical Data
·
Case: JEDEC SOD-123 molded plastic
·
Polarity: Color band denotes positive end
( cathode ) except for bidirectional
SOD-123
Dim
Min
Max
A
0.55 Typ
B
1.40
1.70
C
3.55
3.85
H
2.55
2.85
J
0.00
0.10
K
1.00
1.35
L
0.25
0.40
M
0.10
0.15
0
8°
α
All Dimensions in mm
·
Marking code: see TABLE 1
·
Weight: 0.006 ounces, 0.02 grams
·
Mounting position: Any
Maximum Ratings and Electrical Characteristics
@ T
A
= 25°C unless otherwise specified
SYMBOL
Non-repetitive peak pulse power dissipation
with a 10/1000µs waveform (NOTE 1)
Power dissipation at T
A
=25℃ (NOTE 2)
Reverse current at stand-off voltage @ V
WM
Maximum instantaneous forward voltage at 0.2A
Thermal resistance junction to ambient
Operating temperature junction range
Storage temperature range
NOTES:(1)T
J
=25℃ prior to surge.
(2)Mounted on epoxy-glass PCB with 3×3 mm Cu pads(≥40µm thick)
(3)Non-repetitive peak reverse current in accordance with "IEC 60-1,Section 8" (10/1000
µs
pulse)
VALUE
UNITS
P
PPM
P
tot
I
R
V
F
R
θJA
T
J
T
STG
150
0.8
SEE TABLE 1
1.2
180
- 55 to +150
- 55 to +150
Watts
Watts
µA
Volts
K/W
℃
℃
1of2
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
