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IRF840S

Description
8 A, 500 V, 0.85 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
Categorysemiconductor    Discrete semiconductor   
File Size1MB,5 Pages
ManufacturerKEXIN
Websitehttp://www.kexin.com.cn/html/index.htm
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IRF840S Overview

8 A, 500 V, 0.85 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB

IRF840S Parametric

Parameter NameAttribute value
Number of terminals2
Minimum breakdown voltage500 V
Processing package descriptionTO-263, 3 PIN
stateTRANSFERRED
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
terminal coatingtin lead
Terminal locationsingle
Packaging MaterialsPlastic/Epoxy
structuresingle
Shell connectionDRAIN
Number of components1
transistor applicationsswitch
Transistor component materialssilicon
Channel typeN channel
field effect transistor technologyMetal-OXIDE SEMICONDUCTOR
operating modeENHANCEMENT
Transistor typeuniversal power supply
Maximum leakage current8 A
Maximum drain on-resistance0.8500 ohm
SMD Type
N-Channel
MOSFET
IRF840S
(KRF840S)
MOSFET
Features
V
DS (V)
=500V
I
D
=8 A (V
GS
= 10V)
R
DS(ON)
<0.85Ω
(V
GS
= 10V)
Fast switching
Low thermal resistance
d
g
s
Absolute Maximum Ratings Ta = 25℃
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Avalanche Current
Power Dissipation
Non-Repetitive Avalanche Energy (Note.1)
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
(Note.2)
Thermal Resistance.Junction- to-Ambient
Thermal Resistance Junction to Mounting Base
Junction Temperature
Storage Temperature Range
Tc = 25℃
Ta = 25℃
Ta = 25℃
Ta = 100℃
Symbol
V
DS
V
GS
I
D
I
DM
I
AR
P
D
E
AS
E
AR
dv/dt
R
thJA
R
thJB
T
J
T
stg
Rating
500
±20
8
5.1
32
8
125
3.1
510
13
3.5
60
0.85
150
-55 to 150
W
mJ
V/ns
℃/W
A
Unit
V
Note.1: L = 14mH, I
AS
= 8A, V
DD
= 50V, R
G
= 25Ω , Starting T
J
= 25°C.
Note.2: I
SD
8 A, di/dt
100A/μs, V
DD
V
(BR)DSS
, Starting T
J
25°C.
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