XLS88C681P/28L datasheet, PDF - EEWORLD Datasheet

XLS88C681P/28L: DescriptionSerial I/O Controller, CMOS, PDIP28,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，30 Pages; ManufacturerExel Microelectronics Inc

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XLS88C681P/28L Overview

Serial I/O Controller, CMOS, PDIP28,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	101331791
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

	XLS88C681P/28L	XLS88C681P/28	XLS68C681C	XLS88C681P/40L
Description	Serial I/O Controller, CMOS, PDIP28,	Serial I/O Controller, CMOS, PDIP28,	Serial I/O Controller, CMOS, CDIP40,	Serial I/O Controller, CMOS, PDIP40,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Objectid	101331791	101331792	101331760	101331922
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-XDIP-T40	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0
Number of terminals	28	28	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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