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UR5596-S08-R

Description
BUS TERMINATOR SUPPORT CIRCUIT, PDSO8
Categorysemiconductor    Analog mixed-signal IC   
File Size220KB,12 Pages
ManufacturerETL [E-Tech Electronics LTD]
Download Datasheet Parametric Compare View All

UR5596-S08-R Overview

BUS TERMINATOR SUPPORT CIRCUIT, PDSO8

UR5596-S08-R Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals8
Maximum operating temperature125 Cel
Minimum operating temperature0.0 Cel
Rated supply voltage 12.5 V
Processing package descriptionSOP-8
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal spacing1.27 mm
terminal coatingTIN LEAD
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelOTHER
Interface TypeBUS TERMINATOR SUPPORT CIRCUIT
UNISONIC TECHNOLOGIES CO., LTD
UR5596
DDR TERMINATION
REGULATOR
DESCRIPTION
The UTC
UR5596
is a linear bus termination regulator and
designed to meet JEDEC SSTL-2(Stub-Series Terminated Logic)
specifications for termination of DDR-SDRAM. It also can be
used in SSTL-3 or HSTL (High-Speed Transceiver Logic)
scheme. The device contains a high-speed OP AMP to provide
excellent response to the load transients, and can deliver 1.5A
continuous current and transient peaks up to 3A in the application
as required for DDR-SDRAM termination.
The UTC
UR5596
also incorporates a V
SENSE
pin to provide
superior load regulation and a V
REF
output as a reference for the
chipset and DIMMs. Besides, an active low shutdown (SHDN) pin
provides Suspend To RAM (STR) functionality. When SHDN is
pulled low the V
TT
output will tri-state providing a high impedance
output, but, V
REF
will remain active. A power savings advantage
can be obtained in this mode through lower quiescent current.
Regarding the output, V
TT
is capable of sinking and sourcing
current while regulating the output voltage equal to V
DDQ
/2. The
output stage has been designed to maintain excellent load
regulation while preventing shoot through. The UTC
UR5596
also
incorporates two distinct power rails that separates the analog
circuitry from the power output stage. This allows a split rail
approach to be utilized to decrease internal power dissipation and
permits UTC
UR5596
to provide a termination solution for DDRII
SDRAM.
CMOS IC
*Pb-free plating product number: UR5596L
FEATURES
* Source and sink current
* Low output voltage offset
* No external resistors required
* Linear topology
* Suspend To Ram (STR) functionality
* Low external component count
* Thermal shutdown protection
ORDERING INFORMATION
Ordering Number
Normal
Lead Free Plating
UR5596-S08-R
UR5596L-S08-R
UR5596-S08-T
UR5596L-S08-T
UR5596-SH2-R
UR5596L-SH2-R
UR5596-SH2-T
UR5596L-SH2-T
UR5596L-S08-R
(1) Packing Type
(2) Package Type
(3) Lead Plating
www.unisonic.com.tw
Copyright © 2008 Unisonic Technologies Co., Ltd
(1) R: Tape Reel, T: Tube
(2) S08: SOP-8
(3) L: Lead Free Plating, Blank: Pb/Sn
1 of 12
QW-R502-045,C
Package
SOP-8
SOP-8
HSOP-8
HSOP-8
Packing
Tape Reel
Tube
Tape Reel
Tube

UR5596-S08-R Related Products

UR5596-S08-R UR5596-S08-T UR5596-SH2-R UR5596-SH2-T UR5596
Description BUS TERMINATOR SUPPORT CIRCUIT, PDSO8 BUS TERMINATOR SUPPORT CIRCUIT, PDSO8 BUS TERMINATOR SUPPORT CIRCUIT, PDSO8 BUS TERMINATOR SUPPORT CIRCUIT, PDSO8 BUS TERMINATOR SUPPORT CIRCUIT, PDSO8
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 125 Cel 125 Cel 125 Cel 125 Cel 125 Cel
Minimum operating temperature 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel
Rated supply voltage 1 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Processing package description SOP-8 SOP-8 SOP-8 SOP-8 SOP-8
state ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Craftsmanship CMOS CMOS CMOS CMOS CMOS
packaging shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package Size SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
surface mount Yes Yes Yes Yes Yes
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal spacing 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
terminal coating TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Temperature level OTHER OTHER OTHER OTHER OTHER
Interface Type BUS TERMINATOR SUPPORT CIRCUIT BUS TERMINATOR SUPPORT CIRCUIT BUS TERMINATOR SUPPORT CIRCUIT BUS TERMINATOR SUPPORT CIRCUIT BUS TERMINATOR SUPPORT CIRCUIT
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