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IC51-0804-819-2

Description
QFP80, IC SOCKET
CategoryThe connector    socket   
File Size597KB,6 Pages
ManufacturerYamaichi Electronics Co., Ltd.
Websitehttp://www.yamaichi.com/
Download Datasheet Parametric View All

IC51-0804-819-2 Overview

QFP80, IC SOCKET

IC51-0804-819-2 Parametric

Parameter NameAttribute value
MakerYamaichi Electronics Co., Ltd.
Reach Compliance Codeunknown
ECCN codeEAR99
body width0.551 inch
body length0.787 inch
Contact to complete cooperationAU ON NI
Contact materialBE-CU
Contact styleSINGLE PRONG
Device slot typeIC SOCKET
Type of equipment usedQFP80
Dielectric withstand voltage700VAC V
Shell materialPOLYSULPHONE
Insulation resistance1000000000 Ω
Manufacturer's serial numberIC51
Plug contact pitch0.031 inch
Installation methodSTRAIGHT
Number of contacts80
PCB contact patternSTAGGERED
Terminal pitch1.6002 mm
Termination typeSOLDER
Base Number Matches1
SMT Devices
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD
®
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
*QFP variations e.g. BQFP...
0.4mm to 1.27 Pitch
Part Number (Details)
Mating Cycles:
1,000MΩ min. at 100V DC
for 1 minute (socket depended)
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
10,000 insertions min.
IC51
Series No.
-
064
4
-
807
No. of Contact Pins
Number of Sides
with Contacts
Design Number
As speci cations for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Materials and Finish
Housing: Polysulphone (PSF), glass- lled
Polyethersulphone (PES), glass- lled
Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC51 (Clamshell)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Current Rating:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
1A max.
–55°C to +170°C
25,000 insertions min.
50g to 150g per pin
0.635mm Pitch
Part Number (Details)
IC51
Series No.
-
100
4
-
827
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC211 (Open Top)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Contact Force:
Mating Cycles:
1,000MΩ min. at 500V DC
500V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +170°C
20g to 80g per pin
10,000 insertions min.
0.635mm Pitch
Part Number (Details)
IC211
Series No.
-
132
4
-
002
*
-
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
Protection Key*
*
K = With Protection Key
Unmarked = Without Protection Key
**Protection Key: Prevents IC from releasing during transportation
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
..
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

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