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IC51-0804-819-8

Description
QFP80, IC SOCKET
CategoryThe connector   
File Size597KB,6 Pages
ManufacturerYamaichi Electronics Co., Ltd.
Websitehttp://www.yamaichi.com/
Download Datasheet Parametric View All

IC51-0804-819-8 Overview

QFP80, IC SOCKET

IC51-0804-819-8 Parametric

Parameter NameAttribute value
Type of equipment usedQFP80
Number of contacts80
stateContact Mfr
width0.5510 inch
body_length0.7870 inch
Contact surface matchingAU ON NI
Contact materialsBE-CU
contact_styleSINGLE PRONG
Device slot typeIC SOCKET
dielectric_withstanding_voltage700VAC
shell materialPOLYSULPHONE
insulation_resistance1.00E9 ohm
Manufacturer SeriesIC51
mating_contact_pitch__inch_0.031
Installation methodSTRAIGHT
cb_contact_patteSTAGGERED
Terminal spacing1.6 mm
Terminal typeSOLDER
dditional_featureLIDLESS
SMT Devices
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD
®
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
*QFP variations e.g. BQFP...
0.4mm to 1.27 Pitch
Part Number (Details)
Mating Cycles:
1,000MΩ min. at 100V DC
for 1 minute (socket depended)
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
10,000 insertions min.
IC51
Series No.
-
064
4
-
807
No. of Contact Pins
Number of Sides
with Contacts
Design Number
As speci cations for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Materials and Finish
Housing: Polysulphone (PSF), glass- lled
Polyethersulphone (PES), glass- lled
Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC51 (Clamshell)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Current Rating:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
1A max.
–55°C to +170°C
25,000 insertions min.
50g to 150g per pin
0.635mm Pitch
Part Number (Details)
IC51
Series No.
-
100
4
-
827
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC211 (Open Top)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Contact Force:
Mating Cycles:
1,000MΩ min. at 500V DC
500V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +170°C
20g to 80g per pin
10,000 insertions min.
0.635mm Pitch
Part Number (Details)
IC211
Series No.
-
132
4
-
002
*
-
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
Protection Key*
*
K = With Protection Key
Unmarked = Without Protection Key
**Protection Key: Prevents IC from releasing during transportation
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
..
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
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