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IXFH60N25Q

Description
60 A, 250 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247
Categorysemiconductor    Discrete semiconductor   
File Size71KB,2 Pages
ManufacturerIXYS ( Littelfuse )
Websitehttp://www.ixys.com/
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IXFH60N25Q Overview

60 A, 250 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247

IXFH60N25Q Parametric

Parameter NameAttribute value
Minimum breakdown voltage250 V
Number of terminals3
Processing package descriptionTO-247, 3 PIN
each_compliYes
EU RoHS regulationsYes
stateActive
Rated avalanche energy1500 mJ
Shell connectionDRAIN
structureSINGLE WITH BUILT-IN DIODE
drain_current_max__abs___id_60 A
Maximum leakage current60 A
Maximum drain on-resistance0.0470 ohm
field effect transistor technologyMETAL-OXIDE SEMICONDUCTOR
jedec_95_codeTO-247
jesd_30_codeR-PSFM-T3
moisture_sensitivity_levelNOT SPECIFIED
Number of components1
operating modeENHANCEMENT MODE
Maximum operating temperature150 Cel
Packaging MaterialsPLASTIC/EPOXY
packaging shapeRECTANGULAR
Package SizeFLANGE MOUNT
eak_reflow_temperature__cel_NOT SPECIFIED
larity_channel_typeN-CHANNEL
wer_dissipation_max__abs_360 W
Maximum leakage current pulse240 A
qualification_statusCOMMERCIAL
sub_categoryFET General Purpose Powe
surface mountNO
terminal coatingNOT SPECIFIED
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
ime_peak_reflow_temperature_max__s_NOT SPECIFIED
Transistor component materialsSILICON
dditional_featureAVALANCHE RATED
Advanced Technical Information
HiPerFET
TM
Power MOSFETs
Q-Class
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt, Low t
rr
Low Gate Charge and Capacitances
Symbol
V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt
P
D
T
J
T
JM
T
stg
T
L
M
d
Weight
1.6 mm (0.063 in) from case for 10 s
Mounting torque
TO-247
TO-264
TO-247
TO-264
TO-268
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C; R
GS
= 1 MW
Continuous
Transient
T
C
= 25°C
T
C
= 25°C, pulse width limited by T
JM
T
C
= 25°C
T
C
= 25°C
T
C
= 25°C
I
S
£
I
DM
, di/dt
£
100 A/ms, V
DD
£
V
DSS
,
T
J
£
150°C, R
G
= 2
W
T
C
= 25°C
IXFH 60N25Q
IXFK 60N25Q
IXFT 60N25Q
V
DSS
I
D25
R
DS(on)
t
rr
= 250 V
= 60 A
= 47 mW
£
250 ns
Maximum Ratings
250
250
±20
±30
60
240
60
45
1.5
5
360
-55 ... +150
150
-55 ... +150
300
V
V
V
V
A
A
A
mJ
J
V/ns
W
°C
°C
°C
°C
TO-247 AD (IXFH)
(TAB)
TO-268 (D3) ( IXFT)
G
S
(TAB)
TO-264 AA (IXFK)
G
D
S
D (TAB)
1.13/10 Nm/lb.in.
0.9/6 Nm/lb.in.
6
10
4
g
g
g
G = Gate
S = Source
TAB = Drain
Features
• Low gate charge
• International standard packages
• Epoxy meet UL 94 V-0, flammability
classification
• Low R
DS (on)
HDMOS
TM
process
• Rugged polysilicon gate cell structure
• Avalanche energy and current rated
• Fast intrinsic Rectifier
Advantages
• Easy to mount
• Space savings
• High power density
Symbol
Test Conditions
Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
250
2
4
±200
T
J
= 25°C
T
J
= 125°C
50
1
V
V
nA
mA
mA
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 4 mA
V
GS
=
±20
V
DC
, V
DS
= 0
V
DS
= V
DSS
V
GS
= 0 V
V
GS
= 10 V, I
D
= 0.5 • I
D25
Pulse test, t
£
300
ms,
duty cycle d
£
2 %
47 mW
IXYS reserves the right to change limits, test conditions, and dimensions.
98630 (6/99)
© 2000 IXYS All rights reserved
1-2

IXFH60N25Q Related Products

IXFH60N25Q IXFK60N25Q IXFT60N25Q
Description 60 A, 250 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247 60 A, 250 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247 60 A, 250 V, 0.047 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247
Minimum breakdown voltage 250 V 250 V 250 V
Number of terminals 3 3 3
Processing package description TO-247, 3 PIN TO-247, 3 PIN TO-247, 3 PIN
each_compli Yes Yes Yes
EU RoHS regulations Yes Yes Yes
state Active Active Active
Rated avalanche energy 1500 mJ 1500 mJ 1500 mJ
Shell connection DRAIN DRAIN DRAIN
structure SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
drain_current_max__abs___id_ 60 A 60 A 60 A
Maximum leakage current 60 A 60 A 60 A
Maximum drain on-resistance 0.0470 ohm 0.0470 ohm 0.0470 ohm
field effect transistor technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
jedec_95_code TO-247 TO-247 TO-247
jesd_30_code R-PSFM-T3 R-PSFM-T3 R-PSFM-T3
moisture_sensitivity_level NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Number of components 1 1 1
operating mode ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 Cel 150 Cel 150 Cel
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
packaging shape RECTANGULAR RECTANGULAR RECTANGULAR
Package Size FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT
eak_reflow_temperature__cel_ NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
larity_channel_type N-CHANNEL N-CHANNEL N-CHANNEL
wer_dissipation_max__abs_ 360 W 360 W 360 W
Maximum leakage current pulse 240 A 240 A 240 A
qualification_status COMMERCIAL COMMERCIAL COMMERCIAL
sub_category FET General Purpose Powe FET General Purpose Powe FET General Purpose Powe
surface mount NO NO NO
terminal coating NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location SINGLE SINGLE SINGLE
ime_peak_reflow_temperature_max__s_ NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Transistor component materials SILICON SILICON SILICON
dditional_feature AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED

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