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NPI52C181MTRF

Description
1 ELEMENT, 180 uH, GENERAL PURPOSE INDUCTOR, SMD
CategoryPassive components   
File Size160KB,9 Pages
ManufacturerNIC
Websitehttps://www.niccomp.com
Download Datasheet View All

NPI52C181MTRF Overview

1 ELEMENT, 180 uH, GENERAL PURPOSE INDUCTOR, SMD

NPI Power Inductors
FEATURES
• HIGH CURRENT, SMALL SIZE (UP TO 4 AMPS)
• SURFACE MOUNTABLE CONSTRUCTION
• HIGH INDUCTANCE (UP TO 820µH)
• TAPED AND REELED FOR AUTOMATIC INSERTION
• FOR USE IN DC/DC CONVERTERS, DC/AC INVERTERS
• Pb-FREE COMPATIBLE
CHARACTERISTICS
Case Size
Inductance Range
Inductance Tolerance
Ambient Operating
Temperature Range
Maximum Component
Temperature
(Ambient + Self-Heating)
Inductance Change at Isat
Temperature Raise at Irms
Resistance to Solder Heat
NPI32C
1 ~ 470µH
NPI43C
1 ~ 680µH
NPI52C
1 ~ 560µH
includes all homogeneous materials
NPI__C Series
RoHS
Compliant
*See Part Number System for Details
NPI54C
1 ~ 680µH
NPI73C
10 ~ 330µH
NPI75C
10 ~ 470µH
NPI104C
10 ~ 560µH
NPI105C
10 ~ 820µH
10% (K), 20% (M)
-40°C ~ +85°C*
+125°C*
-30% max.
+40°C max.
260°C for 10 seconds
DIMENSIONS (mm)
Series
NPI32C
NPI43C
NPI52C
NPI54C
NPI73C
NPI75C
NPI104C
NPI105C
A
3.50 ± 0.3
4.50 ± 0.3
5.80 ± 0.3
5.80 ± 0.3
7.80 ± 0.3
7.80 ± 0.3
10.0 ± 0.3
10.0 ± 0.4
A
B
3.00 ± 0.3
4.00 ± 0.3
5.20 ± 0.3
5.20 ± 0.3
7.00 ± 0.3
7.00 ± 0.3
9.00 ± 0.3
9.00 ± 0.4
C
2.10 ± 0.3
3.20 ± 0.3
2.00 ± 0.3
4.50 ± 0.3
3.50 ± 0.5
5.00 ± 0.5
4.00 ± 0.5
5.40 ± 0.4
G (Ref)
1.1
1.5
1.7
1.7
2.0
2.0
2.5
2.5
H (Ref)
3.3
4.5
5.5
5.5
7.5
7.5
9.5
9.5
I (Ref)
1.30
1.75
2.15
2.15
3.0
3.0
3.75
3.75
REFLOW SOLDERING
LAND PATTERN
I
I
H
G
150
B
C
Termination Plating
Sn 96.5% - Ag 3.0% - Cu 0.5%
REFLOW SOLDERING PROFILE
PART NUMBER SYSTEM
NPI 43 C 4R7 M TR F
Temperature °C
RoHS Compliant
Packaging: TR = Tape & Reel
Inductance Tolerance Code: M=±20%
Inductance Code (µH):
1st two digits are significant,
3rd digit is multiplier for values from 10µH and up.
Construction Code (see drawing for details)
Size Code (see table for details)
Series
300
250
200
150
100
50
25
30
60
Pre-Heat
150°C ~ 180°C
60 ~ 120 sec.
Soldering 260°C max.
5 seconds max.
Time above 230°C
30 seconds max.
Cool Down
®
90 120 150 180 210 240 270 300
Time - Seconds
*Specifications reflect recent product changes. For more information refer to PCN announcement [Link]
54
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
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