
SPI BUS 2Kbit (256 x 8bit) EEPROM
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ROHM Semiconductor |
| Parts packaging code | MSOP |
| package instruction | VSSOP, TSSOP8,.16 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 5 MHz |
| Data retention time - minimum | 40 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e2 |
| length | 2.9 mm |
| memory density | 2048 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VSSOP |
| Encapsulate equivalent code | TSSOP8,.16 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.9 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.000002 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Copper (Sn97.5Cu2.5) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 10 |
| width | 2.8 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE/SOFTWARE |
| BR25L020FVM-W | BR25L020F-W | BR25L020FV-W | BR25L020FJ-W | BR25L020FVJ-W | BR25L020FVT-W | |
|---|---|---|---|---|---|---|
| Description | SPI BUS 2Kbit (256 x 8bit) EEPROM | SPI BUS 2Kbit (256 x 8bit) EEPROM | SPI BUS 2Kbit (256 x 8bit) EEPROM | SPI BUS 2Kbit (256 x 8bit) EEPROM | SPI BUS 2Kbit (256 x 8bit) EEPROM | SPI BUS 2Kbit (256 x 8bit) EEPROM |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | MSOP | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | VSSOP, TSSOP8,.16 | LSOP, SOP8,.25 | LSSOP, TSSOP8,.25 | SOP, SOP8,.25 | TSSOP, | LSSOP, |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e2 | e2 | e2 | e2 | e2 | e2 |
| length | 2.9 mm | 5 mm | 4.4 mm | 4.9 mm | 3 mm | 4.4 mm |
| memory density | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 | 256 | 256 | 256 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VSSOP | LSOP | LSSOP | SOP | TSSOP | LSSOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Copper (Sn97.5Cu2.5) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 10 | 10 | 10 | 10 | NOT SPECIFIED | NOT SPECIFIED |
| width | 2.8 mm | 4.4 mm | 3 mm | 3.9 mm | 3 mm | 3 mm |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Data retention time - minimum | 40 | 40 | 40 | 40 | - | - |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | - |
| Encapsulate equivalent code | TSSOP8,.16 | SOP8,.25 | TSSOP8,.25 | SOP8,.25 | - | - |
| power supply | 2/5 V | 2/5 V | 2/5 V | 2/5 V | - | - |
| Maximum seat height | 0.9 mm | 1.6 mm | 1.25 mm | - | 1.05 mm | 1.25 mm |
| Maximum standby current | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | - | - |
| Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | - | - |
| write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |