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BR25L020FVM-W

Description
SPI BUS 2Kbit (256 x 8bit) EEPROM
Categorystorage    storage   
File Size330KB,6 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BR25L020FVM-W Overview

SPI BUS 2Kbit (256 x 8bit) EEPROM

BR25L020FVM-W Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerROHM Semiconductor
Parts packaging codeMSOP
package instructionVSSOP, TSSOP8,.16
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)5 MHz
Data retention time - minimum40
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee2
length2.9 mm
memory density2048 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X8
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP8,.16
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2/5 V
Certification statusNot Qualified
Maximum seat height0.9 mm
Serial bus typeSPI
Maximum standby current0.000002 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Copper (Sn97.5Cu2.5)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width2.8 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE/SOFTWARE

BR25L020FVM-W Related Products

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Description SPI BUS 2Kbit (256 x 8bit) EEPROM SPI BUS 2Kbit (256 x 8bit) EEPROM SPI BUS 2Kbit (256 x 8bit) EEPROM SPI BUS 2Kbit (256 x 8bit) EEPROM SPI BUS 2Kbit (256 x 8bit) EEPROM SPI BUS 2Kbit (256 x 8bit) EEPROM
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Parts packaging code MSOP SOIC SOIC SOIC SOIC SOIC
package instruction VSSOP, TSSOP8,.16 LSOP, SOP8,.25 LSSOP, TSSOP8,.25 SOP, SOP8,.25 TSSOP, LSSOP,
Contacts 8 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 5 MHz 5 MHz 5 MHz 5 MHz 5 MHz 5 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PDSO-G8 R-PDSO-G8
JESD-609 code e2 e2 e2 e2 e2 e2
length 2.9 mm 5 mm 4.4 mm 4.9 mm 3 mm 4.4 mm
memory density 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 256 words 256 words 256 words 256 words 256 words 256 words
character code 256 256 256 256 256 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 256X8 256X8 256X8 256X8 256X8 256X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSSOP LSOP LSSOP SOP TSSOP LSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260 NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type SPI SPI SPI SPI SPI SPI
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Copper (Sn97.5Cu2.5) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 10 10 10 10 NOT SPECIFIED NOT SPECIFIED
width 2.8 mm 4.4 mm 3 mm 3.9 mm 3 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Data retention time - minimum 40 40 40 40 - -
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - -
Encapsulate equivalent code TSSOP8,.16 SOP8,.25 TSSOP8,.25 SOP8,.25 - -
power supply 2/5 V 2/5 V 2/5 V 2/5 V - -
Maximum seat height 0.9 mm 1.6 mm 1.25 mm - 1.05 mm 1.25 mm
Maximum standby current 0.000002 A 0.000002 A 0.000002 A 0.000002 A - -
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA - -
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE - -
Base Number Matches - 1 1 1 1 -
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