F-211-2
ERF8–020–05.0–S–DV–TR
™
ERF8–040–05.0–S–DV–TR
(0,80mm) .0315"
ERF8 SERIES
ERF8–060–05.0–L–DV–TR
RUGGED HIGH SPEED SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERF8
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
1.4A @ 95°C
(6 adjacent pins powered)
Operating Temp Range:
-55°C to + 125°C
Voltage Rating:
200 VAC max
RoHS Compliant:
Yes
Board Mates:
ERM8
Cable Mates:
ERCDA, ERDL2,
ERCD, ERDP
Stack
Heights
from 7mm
to 16mm
20 to 150 I/Os
• Edge Rate
TM
contacts
• Latching option
• Extended guide
post option
(1,50mm)
.059"
NOMINAL
WIPE
TM
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
Call Samtec for maximum cycles mated with ERM8
MATED HEIGHT*
0,80mm ERM8/ERF8
Rated @ 3dB Insertion Loss
7mm Stack Height
Single-Ended Signaling
10.5 GHz / 21 Gbps
Differential Pair Signaling
9.5 GHz / 19 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?ERF8
or contact sig@samtec.com
ERF8
LEAD
STYLE
ERM8 LEAD STYLE
Processing:
–02.0 –05.0 –08.0 –09.0
(9,00) (12,00) (15,00) (16,00)
.472
.591
.629
.354
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (005-030)
(0,12mm) .005" max (040-060)
(0,15mm) .006" max (070-075)
Robust Edge Rate
™
contact improves
“Zippered” unmating
–05.0
(7,00) (10,00) (13,00) (14,00)
.394
.512
.551
.276
–07.0
*Processing conditions will affect mated height.
ols
otoc ted
Pr or
Supp
®
ERF8
NO. OF POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
DV
OTHER
OPTION
TR
Down
om/appnote
www.samtec.c mtec.com
@ sa
Contact SIG n protocols
o
for questions
s
PCI Expres
es at
ot
load app n
–005, –010, –013,
–020, –025, –030,
–040, –049, –050,
–060, –070, –075
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
–L
= 10µ"
(0,25µm)
Gold on
contact,
Matte Tin
on tail
–L
= Latching
(Lead Style –05.0 only)
(Not available with –E option)
–TR
= Tape
& Reel
Packaging
–E
= Extended Guide Post
(Lead Style –07.0 only)
(Not available with –L option,
or –013, –025 positions)
A
–S
= 30µ"
(0,76µm)
Gold on
contact,
Matte Tin
on tail
APPLICATIONS
STANDARD
NEXUS5001
™
.org
POWER.org
™
ARM/HSSTP
NEXUS5001
™
.org
POWER.org
™
POS.
11
17
20
23
35
–05.0
(5,10)
.200
SERIES
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
PART NOs.
ASP-137969-01
ASP-130368-01
ASP-130367-01
ASP-130368-01
ASP-135029-01
–07.0
No. of Positions x
(0,80) .0315 + (6,00) .236
–L & –E = No. of Positions x
(0,80) .0315 + (7,50) .295
–ES = No. of Positions x
(0,80) .0315 + (10,00) .394
01
(7,00)
.276
–ES
= Extended
Guide Post Shield
(Lead Style –07.0 only)
(Not available with –L option)
(–010, –020, –025, –030 only)
(7,25)
.285
(5,60)
20
.220
–E
–K
= (6,00mm) .236" DIA
Polyimide Film
Pick & Place Pad
APPLICATION
SPECIFIC
Other positions
and mezzanine stack
heights available.
Call Samtec.
(3,35)
.132
02
2
(5,30
(5,30)
209
.209
(3,35)
.132
32
(1,32)
.052
DIA
(0,80)
.0315
A
(1,07
(1,07)
42
.042
(0,64)
.025
(2,50)
.098
(6,20)
.244
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(5,40)
.213
(0,94)
–L
.037
(7,20)
.283
–ES
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