LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LSGL3333/H0
DATA SHEET
DOC. NO :
REV.
DATE
:
:
QW0905- LSGL3333/H0
A
20
- Mar. - 2009
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSGL3333/H0
Page 1/5
Package Dimensions
5.0
5.9
7.6
8.6
1.5MAX
□
0.5
TYP
25.0MIN
1.0MIN
2.54TYP
+ -
Note : 1.All dimension are in millimeter tolerance is
±
0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0
°
-30
°
30
°
-60
°
60
°
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSGL3333/H0
Page 2/5
Absolute Maximum Ratings at Ta=25
℃
Ratings
Parameter
Symbol
SGL
Forward Current
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
I
F
I
FP
PD
Ir
ESD
T
opr
Tstg
30
100
120
50
500
-20 ~ +80
-30 ~ +100
mA
mA
mW
UNIT
μ
A
V
℃
℃
Electricity or power surge will
the
Use of conductive wrist band or anti-electrosatic
*
Static is recommended when handingdamageLED.LED.devices, aequipment and machinery must be properly
glove
these
All
grounded.
Typical Electrical & Optical Characteristics (Ta=25
℃
)
PART NO
MATERIAL
COLOR
Forward
Peak
Peak
Spectral
voltage
wave
wave
halfwidth
@20mA(V)
length length
△λ
nm
λ
Pnm
λ
Dnm
Viewing
angle
@20mA(mcd)
2
θ
1/2
(deg)
Luminous
intensity
Emitted
LSGL3333/H0
InGaN/SiC
Lens
502
505
30
Typ. Max. Min. Typ.
3.5
4.2
550
900
38
Green Water Clear
Note : 1.The forward voltage data did not including
±
0.1V testing tolerance.
2. The luminous intensity data did not including
±
15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSGL3333/H0
Page 3/5
Typical Electro-Optical Characteristics Curve
SGL CHIP
Fig.1 Forward current vs. Forward Voltage
25
Fig.2 Relative Intensity vs. Forward Current
1.5
Forward Current(mA)
20
10
15
5
0
1.5
2.0
2.5
3.0
3.5
4.0
Relative Intensity
Normalize @20mA
1.0
0.5
0.0
0
5
10
15
20
25
Forward Voltage(V)
Fig.3 Forward Current vs. Ambient Temp
40
Forward Current(mA)
Fig.4 Relative Intensity vs. Ambient Temp
Relative Luminous Intensity(a.u.)
2.0
Forward Current(mA)
30
1.5
20
1.0
10
0.5
0.0
25
30
35
40
45 50
55
60
65
70
0
0
20
40
60
80
100
Ambient Temperature Ta(
℃
)
Ambient Temperature Ta(
℃
)
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0
300
400
500
600
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSGL3333/H0
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
2° /sec
max
Preheat
60 Seconds Max
25°
0° 0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.