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UM6116A-12

Description
Standard SRAM, 2KX8, 120ns, CMOS, PDIP24
Categorystorage    storage   
File Size312KB,7 Pages
ManufacturerUnited Microelectronics Corporation
Websitehttp://www.umc.com/
Download Datasheet Parametric Compare View All

UM6116A-12 Overview

Standard SRAM, 2KX8, 120ns, CMOS, PDIP24

UM6116A-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid101231119
package instructionDIP, DIP24,.6
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T24
JESD-609 codee0
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.001 A
Minimum standby current4.5 V
Maximum slew rate0.035 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

UM6116A-12 Related Products

UM6116A-12 UM6116J-5 UM6116A-10 UM6116AK-12L UM6116AK-70L UM6116J-3 UM6116AK-10
Description Standard SRAM, 2KX8, 120ns, CMOS, PDIP24 Standard SRAM, 2KX8, 55ns, CMOS, CDIP24 Standard SRAM, 2KX8, 100ns, CMOS, PDIP24 Standard SRAM, 2KX8, 120ns, CMOS, PDIP24 Standard SRAM, 2KX8, 70ns, CMOS, PDIP24 Standard SRAM, 2KX8, 90ns, CMOS, CDIP24 Standard SRAM, 2KX8, 100ns, CMOS, PDIP24
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Objectid 101231119 101230203 1274895219 101230770 101230741 101230228 101230763
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.6 DIP, DIP24,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 55 ns 100 ns 120 ns 70 ns 90 ns 100 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T24 R-XDIP-T24 R-PDIP-T24 R-PDIP-T24 R-PDIP-T24 R-XDIP-T24 R-PDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0 e0
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8
Number of terminals 24 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.3 DIP24,.3 DIP24,.6 DIP24,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.001 A 0.00002 A 0.001 A 0.000001 A 0.000001 A 0.00002 A 0.001 A
Minimum standby current 4.5 V 2 V 4.5 V 2 V 2 V 2 V 4.5 V
Maximum slew rate 0.035 mA 0.1 mA 0.045 mA 0.03 mA 0.05 mA 0.1 mA 0.045 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
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