UM6116AK-10 datasheet, PDF - EEWORLD Datasheet

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UM6116AK-10: DescriptionStandard SRAM, 2KX8, 100ns, CMOS, PDIP24; Categorystorage storage; File Size312KB，7 Pages; ManufacturerUnited Microelectronics Corporation; Websitehttp://www.umc.com/

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UM6116AK-10 Overview

Standard SRAM, 2KX8, 100ns, CMOS, PDIP24

UM6116AK-10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	101230763
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.001 A
Minimum standby current	4.5 V
Maximum slew rate	0.045 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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UM6116AK-10 Related Products

	UM6116AK-10	UM6116A-12	UM6116J-5	UM6116A-10	UM6116AK-12L	UM6116AK-70L	UM6116J-3
Description	Standard SRAM, 2KX8, 100ns, CMOS, PDIP24	Standard SRAM, 2KX8, 120ns, CMOS, PDIP24	Standard SRAM, 2KX8, 55ns, CMOS, CDIP24	Standard SRAM, 2KX8, 100ns, CMOS, PDIP24	Standard SRAM, 2KX8, 120ns, CMOS, PDIP24	Standard SRAM, 2KX8, 70ns, CMOS, PDIP24	Standard SRAM, 2KX8, 90ns, CMOS, CDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Objectid	101230763	101231119	101230203	1274895219	101230770	101230741	101230228
package instruction	DIP, DIP24,.3	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	120 ns	55 ns	100 ns	120 ns	70 ns	90 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T24	R-PDIP-T24	R-XDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8
Number of terminals	24	24	24	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.3	DIP24,.3	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.001 A	0.001 A	0.00002 A	0.001 A	0.000001 A	0.000001 A	0.00002 A
Minimum standby current	4.5 V	4.5 V	2 V	4.5 V	2 V	2 V	2 V
Maximum slew rate	0.045 mA	0.035 mA	0.1 mA	0.045 mA	0.03 mA	0.05 mA	0.1 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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