FIFO REGISTER

| HCF40105 | HCC40105BF | HCF40105BC1 | HCF40105BEY | HCF40105B | |
|---|---|---|---|---|---|
| Description | FIFO REGISTER | FIFO REGISTER | FIFO REGISTER | FIFO REGISTER | FIFO REGISTER |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | - |
| Maker | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | - |
| Parts packaging code | - | DIP | QLCC | DIP | - |
| package instruction | - | DIP, DIP16,.3 | PLASTIC, LCC-20 | PLASTIC, DIP-16 | - |
| Contacts | - | 16 | 20 | 16 | - |
| Reach Compliance Code | - | _compli | _compli | _compli | - |
| ECCN code | - | EAR99 | EAR99 | EAR99 | - |
| Maximum access time | - | 370 ns | 370 ns | 370 ns | - |
| Maximum clock frequency (fCLK) | - | 3 MHz | 3 MHz | 3 MHz | - |
| period time | - | 333.33 ns | 333.33 ns | 125 ns | - |
| JESD-30 code | - | R-GDIP-T16 | S-PQCC-J20 | R-PDIP-T16 | - |
| JESD-609 code | - | e0 | e0 | e0 | - |
| memory density | - | 64 bi | 64 bi | 64 bi | - |
| Memory IC Type | - | OTHER FIFO | OTHER FIFO | OTHER FIFO | - |
| memory width | - | 4 | 4 | 4 | - |
| Number of functions | - | 1 | 1 | 1 | - |
| Number of terminals | - | 16 | 20 | 16 | - |
| word count | - | 16 words | 16 words | 16 words | - |
| character code | - | 16 | 16 | 16 | - |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | - | 125 °C | 85 °C | 125 °C | - |
| Minimum operating temperature | - | -55 °C | -40 °C | -55 °C | - |
| organize | - | 16X4 | 16X4 | 16X4 | - |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | - |
| Exportable | - | YES | YES | YES | - |
| Package body material | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | - | DIP | QCCJ | DIP | - |
| Encapsulate equivalent code | - | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | - |
| Package shape | - | RECTANGULAR | SQUARE | RECTANGULAR | - |
| Package form | - | IN-LINE | CHIP CARRIER | IN-LINE | - |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | - |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | - | 3/18 V | 3/15 V | 3/15 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | - | 5.08 mm | 4.57 mm | 5.1 mm | - |
| Maximum supply voltage (Vsup) | - | 18 V | 15 V | 20 V | - |
| Minimum supply voltage (Vsup) | - | 3 V | 3 V | 3 V | - |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | - |
| surface mount | - | NO | YES | NO | - |
| technology | - | CMOS | CMOS | CMOS | - |
| Temperature level | - | MILITARY | INDUSTRIAL | MILITARY | - |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | - | THROUGH-HOLE | J BEND | THROUGH-HOLE | - |
| Terminal pitch | - | 2.54 mm | 1.27 mm | 2.54 mm | - |
| Terminal location | - | DUAL | QUAD | DUAL | - |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | - | 7.62 mm | 8.9662 mm | 7.62 mm | - |