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5962-9207809HTC

Description
SRAM Module, 512KX8, 20ns, CMOS, DIP32, DIP-32
Categorystorage    storage   
File Size243KB,20 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

5962-9207809HTC Overview

SRAM Module, 512KX8, 20ns, CMOS, DIP32, DIP-32

5962-9207809HTC Parametric

Parameter NameAttribute value
Objectid1820273489
Parts packaging codeDIP
package instructionDIP,
Contacts32
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time20 ns
JESD-30 codeR-XDIP-T32
JESD-609 codee4
length42.415 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Package body materialUNSPECIFIED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.13 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
REVISIONS
LTR
E
F
Add case outline T.
Table I; Changed the max limit for I
CC
for device types 06 trough 09
from 200 mA to 210 mA. Changes the max limit for I
CCDR
for device
types 06 through 09 from 10.4 mA to 12.8 mA. -sld
Added note to paragraph 1.2.2 and table I to regarding the 4 transistor
design. Added thermal resistance ratings for all case outlines to
paragraph 1.3. Editorial changes throughout. -sld
Table I, t
OH
, change minimum limit for device types 01 through 03 from
15 ns to 5 ns.
Update drawing to the latest requirements of MIL-PRF-38534. -sld
Update drawing to the latest requirements of MIL-PRF-38534. -gc
DESCRIPTION
DATE (YR-MO-DA)
97-02-24
98-06-23
APPROVED
K. A. Cottongim
K. A. Cottongim
G
00-07-03
Raymond Monnin
H
J
K
01-04-09
08-07-08
18-01-23
Raymond Monnin
Robert M. Heber
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
K
15
K
16
K
17
K
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
K
1
K
2
K
3
K
4
K
5
K
6
K
7
K
8
K
9
K
10
K
11
K
12
K
13
K
14
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.dla.mil/landandmaritime
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, STATIC RANDOM ACCESS
MEMORY, CMOS, 512K x 8-BIT
DRAWING APPROVAL DATE
93-01-25
REVISION LEVEL
K
SIZE
A
SHEET
CAGE CODE
67268
1 OF
18
5962-92078
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
5962-E205-18

5962-9207809HTC Related Products

5962-9207809HTC 5962-9207801HTA 5962-9207801HTC 5962-9207805HTC 5962-9207807HTC 5962-9207805HTA
Description SRAM Module, 512KX8, 20ns, CMOS, DIP32, DIP-32 SRAM Module, 512KX8, 120ns, CMOS, DIP-32 SRAM Module, 512KX8, 120ns, CMOS, DIP-32 SRAM Module, 512KX8, 55ns, CMOS, DIP32, DIP-32 SRAM Module, 512KX8, 35ns, CMOS, DIP32, DIP-32 SRAM Module, 512KX8, 55ns, CMOS, DIP-32
Objectid 1820273489 1820273439 1820273441 1820273465 1820273477 1820273463
Parts packaging code DIP DIP DIP DIP DIP DIP
package instruction DIP, DIP, DIP, DIP, DIP, DIP,
Contacts 32 32 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 20 ns 120 ns 120 ns 55 ns 35 ns 55 ns
JESD-30 code R-XDIP-T32 R-XDIP-T32 R-XDIP-T32 R-XDIP-T32 R-XDIP-T32 R-XDIP-T32
JESD-609 code e4 e0 e4 e4 e4 e0
length 42.415 mm 42.415 mm 42.415 mm 42.415 mm 42.415 mm 42.415 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIP DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum seat height 5.13 mm 5.13 mm 5.13 mm 5.13 mm 5.13 mm 5.13 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface GOLD TIN LEAD GOLD GOLD GOLD TIN LEAD
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm

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