SMTBJ SiBOD
™
series
FEATURES
2.16
2.74
2.16
G
Bi-directional transient voltage protection
G
Glass passivated junction
G
Nano second clamping response
G
Surge capability up to 250 (Amps)
G
No performance degradation under service life
G
Industry standard DO-2144AA Jedec outline
G
Available on tape (12mm)
G
UL recognised
Solder Pads
2.26
All dimensions in mm
MECHANICAL CHARACTERISTICS
G
Transfer molded, void free epoxy body
G
Terminals: modified ‘J’ bend for large contact area
G
Tin/Lead plated leads
G
Maximum case temperature for soldering purposes: 230°C for 10 seconds
G
Standard packaging: 12mm tape (meets EIA 481-1)
G
Device marking, device code, logo
2.0
B
A
5.21/5.59
4.06/4.57
.102
.203
0.76/1.27
3.30/3.94
2.18/2.44
SEATING PLANE
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59
SMTBJ SiBOD
™
series
ELECTRICAL CHARACTERISTICS @ 25°C Tamb
SYMBOL
V
RM
V
BR
V
BO
V
T
PARAMETER
Stand-off voltage
Breakdown voltage
Breakover voltage
On-state voltage
I
RM
I
BO
I
H
Stand-off current
Breakover current
Holding current
ABSOLUTE RATINGS
SYMBOL
Ipp
Itsm
di/dt
T stg
Tj
TL
Maximum temperature for soldering
(For period of 10 seconds max)
PARAMETER
Peak Pulse Current
Non-repetitive surge peak on-state current
Critical rate of rise of on-state current
Storage and operating junction temperature range
10/1000 µsec
8-20 µs expo
tp20 ms
Non-repetitive
VALUE
Type A Type B
50 100
150 250
30
100
-40 to +150
150
230
A
A
A
A/µs
°C
°C
°C
Device
Type
SMTBJ050 A or B
SMTBJ070 A or B
SMTBJ100 A or B
SMTBJ120 A or B
SMTBJ170 A or B
SMTBJ200 A or B
Vrm
Irm
@ Vrm
(µA)
1
1
1
1
1
1
Vbr
MIN
60
80
110
140
180
220
Vbo
MAX
80
120
135
165
215
265
Vt
TYP
@ 1A
<2V
<2V
<2V
<2V
<2V
<2V
Ibo
TYP
(mA)
50
50
50
50
50
50
Ih
MIN
(mA)
150
150
150
150
150
150
50
70
100
120
170
200
All parameters are tested using Fet Test™ Model 3600.
60
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