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SML512

Description
Low Current Type (IF=<10mA) Mini-molded chip LEDs
File Size98KB,3 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
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SML512 Overview

Low Current Type (IF=<10mA) Mini-molded chip LEDs

SURFACE MOUNT LED LAMPS
Low Current Type (IF≦10mA) Mini-molded chip LEDs
SML512 Series
Blue
Package Size
(mm)
InGaN on SiC
468nm
1608
(0603)
1.6×0.8
t=0.55
SML512BC4T
Note) "-" will be taken out for emitting color B series.
Absolute Maximum Ratings(Ta=25℃)
Peak
Reverse Operating
Stotage
Power Forward
forward
Emitting
dissipation current
voltage temperature temperature
current
color
P
D
I
F
V
R
T
opr
T
stg
*I
FP
(mW) (mA)
(V)
(°C)
(°C)
(mA)
Blue
74
20
100
5
-30 to +85
-40 to +100
External Dimensions(Unit:mm)
1.6
1.2
Part No.
0.8
SML512BC4T
(0.25)
Chip Center Position
0.55
I
FP
measured under duty
≦1/10,1kHz.
Part No.
Resin Color
Forward
voltage
V
F
Typ.
(V)
I
F
(mA)
5
Reverse
current
I
R
Max.
(µA)
100
V
R
(V)
5
Light wavelength
Peak Half-wave
∆λ
λp
Typ.
(nm)
468
Typ.
(nm)
26
I
F
(mA)
5
Brightness
I
V
Min.
(
mcd
)
Cathode index
Typ.
I
F
(mcd) (mA)
14
5
Tolerance:±0.1
1.0
SML512BC4T
Transparent Clear
2.9
5.6
Directivity
SCANNING ANGLE (deg)
X’
Y’
30°
30°
0.18
Electrode
Electrical Optical Characteristics(Ta=25℃)
60°
60°
90°
100
50
0
50
90°
100
Relative INTENSITY
(%)
(Typ.)
Recommemded Pad Layout
Packaging Spacifications(Unit:mm)
Tape Spacifications:T86〈3,000pcs/reel〉
Reel Spacifications
0.8
Lavel Position
Feeding direction
0.8
4
2
1.75
3.5
1.9
5.5
8
φ1.5
0.8
0.85
φ13
0.73
1
(Unit:mm)
0.5
φ60
φ180
The recommended thickness of the screen mask
for soldering is between 100 and 200μm. The
hole size of the screen mask should be same as
the recommended land pattern or smaller.
11.4

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SML512 SML512BC4T
Description Low Current Type (IF=<10mA) Mini-molded chip LEDs Low Current Type (IF=<10mA) Mini-molded chip LEDs
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