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SML-211

Description
Low Current Type (IF=<10mA) Mini-molded chip LEDs
File Size454KB,3 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Download Datasheet View All

SML-211 Overview

Low Current Type (IF=<10mA) Mini-molded chip LEDs

SURFACE MOUNT LED LAMPS
Low Current Type (IF≦10mA) Mini-molded chip LEDs
SML-211 Series
Yellow
Package Size
(mm)
Orange
AlGaInP on GaAs
590nm
611nm
630nm
Red
2012
(0805)
2.0×1.25
t=0.8
SML-211YT
SML-211DT
SML-211UT
Absolute Maximum Ratings(Ta=25℃)
Peak
Reverse Operating
Stotage
Power Forward
forward
Emitting
dissipation current
voltage temperature temperature
current
color
P
D
I
F
V
R
T
opr
T
stg
*I
FP
(mW) (mA)
(V)
(°C)
(°C)
(mA)
Yellow
Orange
Red
44
20
60
4
-30 to +85
-40 to +85
External Dimensions(Unit:mm)
2.0
+0.2
0
1.4
Part No.
SML-211YT
SML-211DT
SML-211UT
1.25
Cathode mark
*I
FP
measured under duty
≦1/
5,pulse width
≦1ms.
0.25
Electrical Optical Characteristics(Ta=25℃)
Forward
voltage
V
F
Typ.
(V)
SML-211YT
SML-211DT
SML-211UT
I
F
(mA)
2
1.2
Terminal
Part No.
Resin Color
Reverse
current
I
R
Max.
(µA)
100
V
R
(V)
4
Light wavelength
Peak Half-wave
∆λ
λp
Typ.
(nm)
590
611
630
Typ.
(nm)
15
16
18
2
I
F
(mA)
Brightness
I
V
Min.
(
mcd
)
Typ.
I
F
(mcd) (mA)
4
2.5
2
Tolerance:±0.1
Transparent
Clear
1.4
0.9
1.8
Directivity
X’
Y’
30°
30°
0.8
60°
60°
90°
100
50
0
50
90°
100
Relative brightness
(%)
(Typ.)
Recommemded Pad Layout
Packaging Spacifications(Unit:mm)
Tape Spacifications:T86〈3,000pcs/reel〉
Reel Spacifications
1.1
Lavel Position
1.25
Feeding direction
4
2
1.75
3.5
2.5
5.5
8
φ1.5
1.25
1.1
φ13
1.0
1.7
(Unit:mm)
0.5
φ60
φ180
The recommended thickness of the screen mask
for soldering is between 100 and 200μm. The
hole size of the screen mask should be same as
the recommended land pattern or smaller.
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