TTS92256GJ-10M-3 datasheet, PDF

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TTS92256GJ-10M-3: DescriptionStandard SRAM, 32KX8, 100ns, CMOS, CQCC32; Categorystorage storage; File Size447KB，10 Pages; ManufacturerTwilight Technology Inc.

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TTS92256GJ-10M-3 Overview

Standard SRAM, 32KX8, 100ns, CMOS, CQCC32

TTS92256GJ-10M-3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	113179387
package instruction	QCCJ, LDCC32,.5X.6
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-XQCC-J32
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.003 A
Minimum standby current	4.5 V
Maximum slew rate	0.07 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD

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TTS92256GJ-10M-3 Related Products

	TTS92256GJ-10M-3	TTS92256GJ-10C-1	TTS92256GJ-10C-2	TTS92256GJ-10I-2	TTS92256GJ-10M-1	TTS92256GJ-70I-1	TTS92256GJ-85I-1	TTS92256GJ-85M-1	TTS92256N-10M-12
Description	Standard SRAM, 32KX8, 100ns, CMOS, CQCC32	Standard SRAM, 32KX8, 100ns, CMOS, CQCC32	Standard SRAM, 32KX8, 100ns, CMOS, CQCC32	Standard SRAM, 32KX8, 100ns, CMOS, CQCC32	Standard SRAM, 32KX8, 100ns, CMOS, CQCC32	Standard SRAM, 32KX8, 70ns, CMOS, CQCC32	Standard SRAM, 32KX8, 85ns, CMOS, CQCC32	Standard SRAM, 32KX8, 85ns, CMOS, CQCC32	Standard SRAM, 32KX8, 100ns, CMOS, CQCC32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Objectid	113179387	113179328	113179348	113179357	113179377	113179344	113179345	113179371	113179896
package instruction	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCN, LCC32,.45X.55
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	EAR99	EAR99	EAR99	3A001.A.2.C	EAR99	EAR99	3A001.A.2.C	3A001.A.2.C
Maximum access time	100 ns	100 ns	100 ns	100 ns	100 ns	70 ns	85 ns	85 ns	100 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32	R-XQCC-N32
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8
Number of terminals	32	32	32	32	32	32	32	32	32
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	70 °C	85 °C	125 °C	85 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-	-	-40 °C	-55 °C	-40 °C	-40 °C	-55 °C	-55 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCN
Encapsulate equivalent code	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LCC32,.45X.55
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.003 A	0.003 A	0.00017 A	0.00017 A	0.003 A	0.003 A	0.003 A	0.00017 A	0.003 A
Minimum standby current	4.5 V	4.5 V	2 V	2 V	4.5 V	4.5 V	4.5 V	2 V	4.5 V
Maximum slew rate	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD

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