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LM48F010-300

Description
Flash, 128KX8, 300ns, CQCC32
Categorystorage    storage   
File Size650KB,12 Pages
ManufacturerLSC/CSI
Websitehttps://lsicsi.com
Download Datasheet Parametric Compare View All

LM48F010-300 Overview

Flash, 128KX8, 300ns, CQCC32

LM48F010-300 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid101110705
package instructionQCCN, LCC32,.45X.55
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time300 ns
command user interfaceNO
Data pollingNO
Durability100 Write/Erase Cycles
JESD-30 codeR-XQCC-N32
JESD-609 codee0
memory density1048576 bit
Memory IC TypeFLASH
memory width8
Number of departments/size128
Number of terminals32
word count131072 words
character code128000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Department size1K
Maximum standby current0.0004 A
Maximum slew rate0.06 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
switch bitNO
typeNOR TYPE

LM48F010-300 Related Products

LM48F010-300 FM48F010-300 FM48F010-250 LM48F010K-250
Description Flash, 128KX8, 300ns, CQCC32 Flash, 128KX8, 300ns, CDFP32 Flash, 128KX8, 250ns, CDFP32 Flash, 128KX8, 250ns, CQCC32
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction QCCN, LCC32,.45X.55 DFP, FL32,.4 DFP, FL32,.4 QCCN, LCC32,.45X.55
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 300 ns 300 ns 250 ns 250 ns
command user interface NO NO NO NO
Data polling NO NO NO NO
Durability 100 Write/Erase Cycles 100 Write/Erase Cycles 100 Write/Erase Cycles 1000 Write/Erase Cycles
JESD-30 code R-XQCC-N32 R-XDFP-F32 R-XDFP-F32 R-XQCC-N32
JESD-609 code e0 e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH FLASH FLASH
memory width 8 8 8 8
Number of departments/size 128 128 128 128
Number of terminals 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 128KX8 128KX8 128KX8 128KX8
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QCCN DFP DFP QCCN
Encapsulate equivalent code LCC32,.45X.55 FL32,.4 FL32,.4 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER FLATPACK FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Department size 1K 1K 1K 1K
Maximum standby current 0.0004 A 0.0004 A 0.0004 A 0.0004 A
Maximum slew rate 0.06 mA 0.06 mA 0.06 mA 0.06 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD FLAT FLAT NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL DUAL QUAD
switch bit NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE
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