EEWORLDEEWORLDEEWORLD

Part Number

Search

WBCR0279530AC

Description
Fixed Resistor, Thin Film, 0.25W, 953ohm, 75V, 0.2% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size98KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

WBCR0279530AC Overview

Fixed Resistor, Thin Film, 0.25W, 953ohm, 75V, 0.2% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP

WBCR0279530AC Parametric

Parameter NameAttribute value
Objectid1352976946
package instructionCHIP
Reach Compliance Codeunknown
ECCN codeEAR99
Manufacturer's serial numberBCR
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance953 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.2%
Operating Voltage75 V
BCR
Vishay Electro-Films
Thin Film, Back-Contact Resistor
CHIP
RESISTORS
FEATURES
Wire bondable
Product may not
be to scale
Only one wire bond required
Small size: 0.020 inches square.
Resistance range: 10
Ω
to 1 MΩ
Oxidized silicon substrate for good power dissipation
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
Resistor material: Tantalum nitride, self-passivating
Moisture resistant
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
5%
2%
1%
0.5 % 0.2 %
0.1 %
PROCESS CODE
CLASS H*
CLASS K*
056
061
059
052
010
002
027
008
*MIL-PRF-38534 inspection criteria
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
360 kΩ
1 MΩ
200 kΩ
620 kΩ
10
Ω
20
Ω
50
Ω
100
Ω
200
Ω
1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
www.vishay.com
54
For technical questions, contact: efi@vishay.com
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 1.0 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
75 V max.
250 mW
± 0.25 % max.
ΔR/R
Document Number: 61023
Revision: 12-Mar-08
How to get the unique identification code of the machine under CE?
In wince4.2, when an application calls KernelIoControl function to get the device id of the machine, how does the OAL layer OEMIoControl function provide it with this id? Is it read from the hardware ...
tencom Embedded System
Sensor Package Application Manual
[i=s]This post was last edited by paulhyde on 2014-9-15 08:57[/i] Sensor package application manual, which contains many sensor introductions. :)...
fpga126 Electronics Design Contest
How to view the output of DbgPrint in Windows drivers
I just started learning Windows driver development with DDK, but I don't know how to view the output of DbgPrint? Can I view it using only the tools in DDK?...
sunl Embedded System
Debussy debugging xilinx ipcore error!
*Error* view FIFO_GENERATOR_V4_4 is not defined for inst inst "F:\0510ofc\dmr_top_v0_2_7\proj\2\down_line_frame_buf.v", 124: *Error* view FIFO_GENERATOR_V4_4 is not defined for inst inst "F:\0510ofc\d...
eeleader FPGA/CPLD
May I ask where can I find the MSP430 header file msp430f14x.h?
Where can I find the header files for MSP430,for example, msp430f14x.h?...
ZXZ2002 Microcontroller MCU
Does anyone have the LPC214X series USB driver?
Does anyone have the USB driver for the LPC214X series? Zhou Ligong bought the LPC2131 development board, but the CD didn't come with the USB driver. Shit! He forced you to spend another 280 yuan to b...
ladeng Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 450  2280  479  96  1667  10  46  2  34  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号