REVISIONS
LTR
A
B
C
DESCRIPTION
Add case outline N. Make changes to 1.2.2, 1.3, and figure 1. - ro
Add case outline 2. Make changes to 1.2.2, 1.3, table I, and figure 2. - ro
Add radiation hardness requirements. Add case outline M. Make changes to
1.2.2, 1.3, table I, figure 1, and figure 2. - ro
Add case outlines 4 and 5. - ro
Make pin assignment corrections to case outlines N and 5 as specified in
figure 2. - ro
Add a footnote to case outline U, TO-257 package as specified under 1.2.3
and figure 1. -rrp
For case outline T only, add footnote 1/ under 1.2.3 and make change to note
2 under figure 1. -rrp
Update drawing to current MIL-PRF-38535 requirements. -rrp
Drawing updated to reflect current MIL-PRF-38535 requirements. -rrp
DATE (YR-MO-DA)
98-12-17
99-10-21
00-02-23
APPROVED
R. MONNIN
R. MONNIN
R. MONNIN
D
E
01-05-18
02-04-15
R. MONNIN
R. MONNIN
F
05-02-04
R. MONNIN
G
06-01-23
R. MONNIN
H
J
15-02-11
21-03-10
C. SAFFLE
J. ESCHMEYER
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
J
15
J
16
REV
SHEET
PREPARED BY
JOSEPH A. KERBY
J
1
J
2
J
3
J
4
J
5
J
6
J
7
J
8
J
9
J
10
J
11
J
12
J
13
J
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
CHARLES E. BESORE
APPROVED BY
MICHAEL A. FRYE
DRAWING APPROVAL DATE
89-09-14
REVISION LEVEL
J
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
https://www.dla.mil/LandandMaritime
MICROCIRCUIT, LINEAR, 12 VOLT NEGATIVE
REGULATOR FIXED, MONOLITHIC SILICON
SIZE
A
CAGE CODE
67268
SHEET
1 OF 16
5962-88747
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
5962-E199-21
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962
½
½
½
Federal
stock class
designator
\
F
½
½
½
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
7912A
Circuit function
1.0 A negative regulator, fixed 12-volt
88747
01
½
½
½
Device
type
(see 1.2.2)
/
U
½
½
½
Case
outline
(see 1.2.3)
A
½
½
½
Lead
finish
(see 1.2.4)
1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
M
N
T 1/
U 1/
X
Y
Z
2
4
5
Descriptive designator
See figure 1
CBCC2-N3
See figure 1
See figure 1
See figure 1
See figure 1
MBFM4-P2
CQCC1-N20
See figure 1
CBCC1-N3
Terminals
3
3
3
3
3
2
2
20
3
3
Package style
Surface mount
Bottom terminal chip carrier
TO-257, single row flange mount,
glass sealed
TO-257, single row flange mount with
an isolated tab, glass sealed
TO-39, can
TO-3, flange mount
TO-66, flange mount
Square leadless chip carrier
Flange mount, glass sealed with
gull wing leads
Bottom terminal chip carrier
1.2.4 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88747
SHEET
J
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings.
Input voltage:
Operating or input shorted to ground .......................................................
Transient ..................................................................................................
Storage temperature range ..........................................................................
Lead temperature (soldering, 10 seconds) ..................................................
Power dissipation (P
D
):
T
C
= +25C:
Cases M, N, T, U, Z, 4, and 5 ...............................................................
Cases X and 2 .....................................................................................
Case Y ..................................................................................................
T
A
= +25C:
Cases M, N, T, U, and Z .......................................................................
Cases X and 2 ......................................................................................
Case Y ..................................................................................................
Case 4 .................................................................................................
Case 5 .................................................................................................
Junction temperature (T
J
) ............................................................................
Thermal resistance, junction-to-case (
JC
):
Case M .....................................................................................................
Cases N and T .........................................................................................
Case U .....................................................................................................
Case X .....................................................................................................
Case Y .....................................................................................................
Case Z .....................................................................................................
Case 2 ......................................................................................................
Case 4 .....................................................................................................
Case 5 .....................................................................................................
Thermal resistance, junction-to-ambient (
JA
):
Cases M, T, U, and Z ..............................................................................
Cases N, X, and 2 ....................................................................................
Case Y .....................................................................................................
Case 4 .....................................................................................................
Case 5 .....................................................................................................
1.4 Recommended operating conditions.
Input voltage range (V
IN
) ............................................................................. -14.5 V dc to -27 V dc
Ambient operating temperature range (T
A
) ................................................. -55C to +125C
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rads(Si) / s) ............... 300 Krads 4/
_____
2/ The 50-volt input rating refers to the ability of the regulator to withstand high line or transient conditions without
damage. Since the regulator’s maximum current capability is reduced, the output may fall out of regulation at high
input voltages under nominal loading.
3/ The device is protected by a thermal shutdown circuit which is designed to turn off the output transistor whenever the
device junction temperature is in excess of +150C.
4/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
-35 V dc
-50 V dc 2/
-65C to +150C
+300C
15 W
2W
20 W
3.0 W
1.0 W
3.6 W
1.7 W
1.3 W
+150C 3/
5.5C/W
3.5C/W
4.2C/W
15C/W
3C/W
6C/W
See MIL-STD-1835
5.1C/W
3.6C/W
42C/W
120C/W
35C/W
60C/W
80C/W
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88747
SHEET
J
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://quicksearch.dla.mil.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the
manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative
approved by the qualifying activity.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.3 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88747
SHEET
J
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/ 3/
-55C
T
A
+125C
unless otherwise specified
T
A
= +25C
V
IN
= -14.5 V to -27 V 4/
M,D,P,L,R,F
Line regulation 5/ 6/
V
RLINE
V
IN
= -14.5 V to -27 V
Test
Symbol
Group A
subgroups
1
1,2,3
1
1
2,3
Device
type
01
Limits
Min
-11.88
-11.64
-11.88
Max
-12.12
-12.36
-12.12
20
50
20
10
30
10
Unit
Output voltage
V
OUT
V
01
mV
M,D,P,L,R,F
V
IN
= -16 V to -22 V
1
1
2,3
M,D,P,L,R,F
Load regulation 5/
V
RLOAD
I
O
= 5.0 mA to 1.5 A 7/
1
1
2,3
01
32
60
32
16
30
16
30
60
mV
M,D,P,L,R,F
I
O
= 250 mA to 750 mA 7/
1
1
2,3
M,D,P,L,R,F
I
O
= 5 mA to 500 mA 8/
1
1
2,3
Standby current drain
I
SCD
1
2,3
M,D,P,L,R,F
1
1,2,3
1
01
3.5
4.0
3.5
mA
Standby current drain
change with line
I
SCD
(line)
V
IN
= -14.5 V to -27 V
M,D,P,L,R,F
01
0.8
0.8
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88747
SHEET
J
5
DSCC FORM 2234
APR 97
MCU
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