5962-9461116H9C datasheet, PDF

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5962-9461116H9C: DescriptionSRAM Module, 512KX32, 17ns, CMOS, CQFP68, CERAMIC, QFP-68; Categorystorage storage; File Size2MB，175 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9461116H9C Overview

SRAM Module, 512KX32, 17ns, CMOS, CQFP68, CERAMIC, QFP-68

5962-9461116H9C Parametric

Parameter Name	Attribute value
Objectid	1820274566
Parts packaging code	QFP
package instruction	QFP,
Contacts	68
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	17 ns
JESD-30 code	S-CQFP-G68
JESD-609 code	e4
length	22.36 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-PRF-38534 Class H
Maximum seat height	3.51 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	GULL WING
Terminal location	QUAD
width	22.36 mm

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INCH-POUND

This document and process

conversion measures necessary

to comply with this revision shall

be completed by 15 May 2018

MIL-PRF-38534K

15 November 2017

SUPERSEDING

MIL-PRF-38534J

13 March 2015

PERFORMANCE SPECIFICATION

HYBRID MICROCIRCUITS,

GENERAL SPECIFICATION FOR

Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime-VAS,

P. O. Box 3990, Columbus, OH 43218-3990, or emailed to

PRF38534@dla.mil.

Since contact information can

change, you may want to verify the currency of this address information using the ASSIST Online database at

https://assist.dla.mil.

AMSC N/A

DISTRIBUTION STATEMENT A. Approved for public release. Distribution in unlimited.

FSC 5962

MIL-PRF-38534K

CONTENTS

PARAGRAPH

PAGE

1. SCOPE ................................................................................................................................................................... 1

1.1 Scope .................................................................................................................................................................. 1

1.2 Description of this specification ........................................................................................................................... 1

1.3 Classification ....................................................................................................................................................... 1

1.3.1 Class K ........................................................................................................................................................... 1

1.3.2 Class H........................................................................................................................................................... 1

1.3.3 Class G .......................................................................................................................................................... 1

1.3.4 Class D........................................................................................................................................................... 2

1.3.5 Class E ........................................................................................................................................................... 2

1.3.6 Class L ........................................................................................................................................................... 2

1.3.7 Class F ........................................................................................................................................................... 2

2. APPLICABLE DOCUMENTS .................................................................................................................................. 2

2.1 General ............................................................................................................................................................... 2

2.2 Government documents ...................................................................................................................................... 2

2.2.1 Specification, standards, and handbooks ....................................................................................................... 2

2.2.2 Other Government documents, drawings, and publications ........................................................................... 2

2.3 Non-Government publications ............................................................................................................................. 3

2.4 Order of precedence ........................................................................................................................................... 3

3. REQUIREMENTS ................................................................................................................................................... 3

3.1 Performance requirements for Class K devices .................................................................................................. 3

3.2 Performance requirements for Class H devices .................................................................................................. 3

3.3 Performance requirements for Class G devices .................................................................................................. 3

3.4 Performance requirements for Class E devices .................................................................................................. 3

3.5 Performance requirements for Class D devices .................................................................................................. 3

3.6 Performance requirements for radiation hardness assurance (RHA) devices ..................................................... 4

3.7 Performance requirements for Class F non-hermetic devices............................................................................. 4

3.8 Performance requirements for Class L non-hermetic devices ............................................................................. 4

3.9 General ............................................................................................................................................................... 6

3.9.1 Implementation of this specification ............................................................................................................... 6

3.9.2 Device specification ....................................................................................................................................... 7

3.9.3 Design and construction ................................................................................................................................. 7

3.9.3.1 Lead finish ................................................................................................................................................. 7

3.9.4 QML qualification requirements...................................................................................................................... 7

3.9.5 Marking of devices ......................................................................................................................................... 8

3.9.5.1 Part or Identifying Number (PIN) ............................................................................................................... 8

3.9.5.1.1 Device type .......................................................................................................................................... 8

3.9.5.1.2 Device class designator ....................................................................................................................... 8

3.9.5.1.3 Case outline ......................................................................................................................................... 8

3.9.5.1.4 Lead finish ............................................................................................................................................ 9

3.9.5.2 Index point................................................................................................................................................. 9

3.9.5.3 Lot identification code (date code) ............................................................................................................ 9

3.9.5.4 Manufacturer’s identification...................................................................................................................... 9

3.9.5.5 Manufacturer’s designating symbol ........................................................................................................... 9

3.9.5.6 Country of manufacture ............................................................................................................................. 9

3.9.5.7 Serialization............................................................................................................................................... 9

3.9.5.7.1 Class K and L serialization ................................................................................................................... 9

3.9.5.7.2 Class H, G, D and F ............................................................................................................................. 9

3.9.5.8 Special marking ......................................................................................................................................... 9

3.9.5.8.1 Beryllium oxide package identifier ...................................................................................................... 10

3.9.5.8.2 Electrostatic discharge (ESD) sensitivity identifier.............................................................................. 10

3.9.5.8.3 Certification mark ............................................................................................................................... 10

3.9.5.9 Marking option for controlled storage of Class H and G .......................................................................... 11

3.10 Item requirements ........................................................................................................................................... 11

3.10.1 Certification of conformance....................................................................................................................... 11

MIL-PRF-38534K

CONTENTS

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3.11 Recycled, recovered, environmentally preferable, or biobased materials ....................................................... 12

3.12 Workmanship .................................................................................................................................................. 12

3.12.1 Rework and repair provisions ..................................................................................................................... 12

4. VERIFICAITON ..................................................................................................................................................... 12

4.1 General verification ........................................................................................................................................... 12

4.2 Quality Management (QM) Program ................................................................................................................. 12

4.3 Baseline process flows ...................................................................................................................................... 12

4.4 Quality management (QM) plan ........................................................................................................................ 13

4.4.1 Self-audit program ........................................................................................................................................ 13

4.4.2 Change control procedures .......................................................................................................................... 13

4.5 Verification for QML listing ................................................................................................................................ 13

4.5.1 Verification audit........................................................................................................................................... 13

4.5.1.1 On-site verification................................................................................................................................... 13

4.5.1.2 Certification ............................................................................................................................................. 13

4.5.1.3 Classes E, G, H, K, F, and L process flow audits .................................................................................... 13

4.5.1.4 Class D process flow audit ...................................................................................................................... 13

4.5.2 Technology capability verification (qualification) .......................................................................................... 13

4.5.2.1 Class H and K QML listing ...................................................................................................................... 14

4.5.2.2 Class G, D, F and L QML listing .............................................................................................................. 14

4.5.2.3 Class E listing .......................................................................................................................................... 14

5. PACKAGING ........................................................................................................................................................ 14

5.1 Packaging ......................................................................................................................................................... 14

6. NOTES .................................................................................................................................................................. 14

6.1 Intended use ..................................................................................................................................................... 14

6.2 Acquisition requirements ................................................................................................................................... 14

6.2.1 Optional acquisition data .............................................................................................................................. 14

6.3 Qualification ...................................................................................................................................................... 15

6.4 Terms, definitions, methods, symbols, and abbreviations ................................................................................. 15

6.4.1 Acquiring activity .......................................................................................................................................... 15

6.4.2 Acquisition documents ................................................................................................................................. 15

6.4.3 Audit checklist .............................................................................................................................................. 15

6.4.4 Baseline index of documents ....................................................................................................................... 15

6.4.5 Baseline process flow................................................................................................................................... 15

6.4.6 Burn-in lot ..................................................................................................................................................... 15

6.4.7 Compliant devices ........................................................................................................................................ 15

6.4.8 Compound bond ........................................................................................................................................... 15

6.4.9 Cpk ............................................................................................................................................................... 15

6.4.10 Critical control parameters ......................................................................................................................... 16

6.4.11 Customer compliance matrix (CCM) .......................................................................................................... 16

6.4.12 Delta (∆) limits ............................................................................................................................................ 16

6.4.13 Design activity ............................................................................................................................................ 16

6.4.14 Design analysis .......................................................................................................................................... 16

6.4.15 Design of experiments (DOE) .................................................................................................................... 16

6.4.16 Design robustness ..................................................................................................................................... 16

6.4.17 Electrostatic discharge sensitivity (ESDS).................................................................................................. 16

6.4.18 Element ...................................................................................................................................................... 16

6.4.19 Film microcircuit ......................................................................................................................................... 16

6.4.20 Final seal .................................................................................................................................................... 16

6.4.21 Flip chi[p bonding ....................................................................................................................................... 16

6.4.22 Hybrid microcircuit ...................................................................................................................................... 16

6.4.23 Hybrid microcircuit type (device type)......................................................................................................... 17

6.4.24 Inspection lots ............................................................................................................................................ 17

6.4.25 Inspection lot formation .............................................................................................................................. 17

iii

MIL-PRF-38534K

CONTENTS

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6.4.26 Integral substrate/package ......................................................................................................................... 17

6.4.27 Known good die (KGD) .............................................................................................................................. 17

6.4.28 Microelectronics ......................................................................................................................................... 17

6.4.29 Microcircuit ................................................................................................................................................. 17

6.4.30 Monolithic microcircuit ................................................................................................................................ 17

6.4.31 Multichip module (MCM) ............................................................................................................................ 17

6.4.32 Non-continuous production ........................................................................................................................ 17

6.4.33 Off-line reliability assessment..................................................................................................................... 17

6.4.34 Package type ............................................................................................................................................. 17

6.4.35 Passive element ......................................................................................................................................... 17

6.4.36 Percent defective allowable (PDA) ............................................................................................................. 17

6.4.37 Periodic capability certification ................................................................................................................... 17

6.4.38 Production lot ............................................................................................................................................. 17

6.4.39 Qualifying activity ....................................................................................................................................... 18

6.4.40 Quality function deployment (QFD) ............................................................................................................ 18

6.4.41 Self-audit .................................................................................................................................................... 18

6.4.42 Semiconductor element.............................................................................................................................. 18

6.4.43 Similar devices ........................................................................................................................................... 18

6.4.44 Standard evaluation circuit (SEC) .............................................................................................................. 18

6.4.45 Statistical process control (SPC) ................................................................................................................ 18

6.4.46 Sub-assembly ............................................................................................................................................ 18

6.4.47 Tape automated bonding (TAB) ................................................................................................................. 18

6.4.48 Technology capability ................................................................................................................................. 18

6.4.49 Wafer lots ................................................................................................................................................... 18

6.5 Destruction tests ............................................................................................................................................... 19

6.6 Nondestructive tests .......................................................................................................................................... 19

6.7 Subject term (key work) listing .......................................................................................................................... 19

6.8 List of acronyms ................................................................................................................................................ 20

6.9 Change from previous issue.............................................................................................................................. 20

A.1 SCOPE ............................................................................................................................................................... 21

A.1.1 Scope............................................................................................................................................................. 21

A.1.2 Technology Review Board ............................................................................................................................. 21

A.1.3 Description of appendix A .............................................................................................................................. 21

A.2 APPLICABLE DOCUMENTS .............................................................................................................................. 21

A.2.1 General .......................................................................................................................................................... 21

A.2.2 Government documents................................................................................................................................. 21

A.2.2.1 Specifications, standards, and handbooks................................................................................................ 21

A.2.3 Non-Government publications ....................................................................................................................... 22

A.2.4 Order of precedence ...................................................................................................................................... 22

A.3 QUALITY SYSTEM REQUIREMENTS ............................................................................................................... 22

A.3.1 Management responsibility ............................................................................................................................ 22

A.3.2 Quality system ............................................................................................................................................... 22

A.3.2.1 QM plan .................................................................................................................................................... 22

A.3.2.1.1 Functional block organization chart...................................................................................................... 22

A.3.2.1.2 Baseline process flowchart .................................................................................................................. 22

A.3.2.1.3 Design guidelines ................................................................................................................................ 22

A.3.2.1.4 Travelers .............................................................................................................................................. 22

A.3.2.1.5 Baseline index of documents ............................................................................................................... 23

A.3.2.1.6 Manufacturer’s self-audit...................................................................................................................... 23

A.3.2.2 Design, processing, manufacturing, and testing instructions .................................................................... 23

A.3.2.3 Design, processing, manufacturing, equipment, and material instructions ............................................... 23

A.3.2.4 Quality improvement program................................................................................................................... 24

A.3.2.5 QM program (TRB option) ........................................................................................................................ 24

MIL-PRF-38534K

CONTENTS

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A.3.2.5.1 General ................................................................................................................................................ 24

A.3.2.5.2 Implementation .................................................................................................................................... 24

A.3.2.5.3 TRB...................................................................................................................................................... 24

A.3.2.5.3.1 TRB organizational structure .......................................................................................................... 25

A.3.2.5.3.2 TRB responsibilities ........................................................................................................................ 25

A.3.2.5.4 Alternative method correlation, confirmation, and implementation procedures .................................... 25

A.3.2.5.4.1 Correlation, confirmation, and implementation ................................................................................ 25

A.3.2.5.4.2 Alternative methods ........................................................................................................................ 26

A.3.2.5.4.2.1 Standard evaluation circuits (SEC) ............................................................................................ 26

A.3.2.5.4.2.2 Periodic assessment of alternative methods .............................................................................. 26

A.3.2.5.5 TRB records ......................................................................................................................................... 26

A.3.3 Conversion of customer requirements ........................................................................................................... 26

A.3.4 Design requirements ...................................................................................................................................... 26

A.3.4.1 Changes in design, materials, or processing ............................................................................................ 27

A.3.5 Change control .............................................................................................................................................. 27

A.3.5.1 Configuration control ................................................................................................................................. 27

A.3.6 Control and acceptance of incoming materials .............................................................................................. 28

A.3.6.1 Supplier control program........................................................................................................................... 28

A.3.6.2 Incoming, in-process, and outgoing inventory control ............................................................................... 28

A.3.7 Customer supplied material ........................................................................................................................... 28

A.3.8 Traceability .................................................................................................................................................... 28

A.3.8.1 Material and element traceability .............................................................................................................. 28

A.3.8.2 Process/test traceability ............................................................................................................................ 28

A.3.8.3 Production lot traceability .......................................................................................................................... 28

A.3.8.4 Country of manufacture ............................................................................................................................ 28

A.3.8.5 Production lot identification ....................................................................................................................... 28

A.3.9 Process control .............................................................................................................................................. 29

A.3.9.1 Process and material controls................................................................................................................... 29

A.3.10 Inspection and testing .................................................................................................................................. 29

A.3.10.1 Inspection operations .............................................................................................................................. 29

A.3.10.2 Quality control operations ....................................................................................................................... 29

A.3.10.3 Performance verification operations........................................................................................................ 29

A.3.10.4 Inspections operations ............................................................................................................................ 29

A.3.11 Tool, gauge, and test equipment maintenance and calibration .................................................................... 29

A.3.11.1 Equipment calibrations............................................................................................................................ 29

A.3.12 Examples of assembly and verification travelers ......................................................................................... 29

A.3.13 Failure and defect analysis and data feedback ............................................................................................ 30

A.3.13.1 Procedure in case of test equipment failure or operator error ................................................................. 30

A.3.13.1.1 Procedure for sample tests ................................................................................................................ 30

A.3.13.1.2 Procedure for screening tests ............................................................................................................ 30

A.3.13.2 Failure and corrective action reports ....................................................................................................... 30

A.3.14 Failure analysis and corrective action program............................................................................................ 30

A.3.14.1 Reports and analyses of defective devices and failure ........................................................................... 30

A.3.15 Atmospheric control and handling................................................................................................................ 30

A.3.15.1 ESD handling control program ................................................................................................................ 30

A.3.15.2 Cleanliness and atmosphere control in work areas ................................................................................ 31

A.3.16 Control of quality records ............................................................................................................................. 31

A.3.16.1 Records to be maintained ....................................................................................................................... 31

A.3.16.1.1 Computerized records........................................................................................................................ 31

A.3.16.2 Altered records ....................................................................................................................................... 31

A.3.17 Internal quality audits ................................................................................................................................... 31

A.3.17.1 Self-audit representatives ....................................................................................................................... 31

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