5962-9461204HUX datasheet, PDF

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5962-9461204HUX: DescriptionFlash Module, 512KX32, 70ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66; Categorystorage storage; File Size160KB，15 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9461204HUX Overview

Flash Module, 512KX32, 70ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66

5962-9461204HUX Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1546172070
package instruction	1.075 INCH, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	70 ns
Other features	USER CONFIGURABLE AS 2M X 8
Spare memory width	16
JESD-30 code	S-CPGA-P66
JESD-609 code	e4
length	27.3 mm
memory density	16777216 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	4.34 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	27.3 mm

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WF512K32-XXX5

HI-RELIABILITY PRODUCT

512Kx32 5V FLASH MODULE, SMD 5962-94612

FEATURES

Access Times of 60, 70, 90, 120, 150ns

Packaging

• 66 pin, PGA Type, 1.075" square, Hermetic

Ceramic HIP (Package 400

(1)

)

• 68 lead, 40mm, Low Capacitance Hermetic CQFP

(Package 501)

• 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP

(Package 502)

• 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U), 3.5mm

(0.140") high, (Package 510)

• 68 lead, 23.9mm (0.940") Low Profile CQFP (G1U), 3.5mm

(0.140") high, (Package 519)

100,000 Erase/Program Cycles Minimum

Sector Architecture

• 8 equal size sectors of 64KBytes each

• Any combination of sectors can be concurrently erased.

Also supports full chip erase

Organized as 512Kx32

Commercial, Industrial and Military Temperature Ranges

5 Volt Programming. 5V

10% Supply.

Low Power CMOS, 6.5mA Standby

Embedded Erase and Program Algorithms

TTL Compatible Inputs and CMOS Outputs

Built-in Decoupling Caps for Low Noise Operation

Page Program Operation and Internal Program Control Time

Weight

WF512K32-XG2UX5 - 8 grams typical

WF512K32-XH1X5 - 13 grams typical

WF512K32-XG4X5 - 20 grams typical

WF512K32-XG4TX5 - 20 grams typical

WF512K32-XG1UX5 - 5 grams typical

1. Call factory for PGA type (HIP) package options.

Note: See Flash Programming Application Note 4M5 for algorithms.

FIG. 1

I/O

PIN CONFIGURATION FOR WF512K32N-XH1X5

TOP VIEW

GND

I/O

GND

I/O

PIN DESCRIPTION

I/O

0-31

0-18

1-4

GND

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

BLOCK DIAGRAM

W E

512K x 8

W E

512K x 8

I/O

0-7

I/O

8-15

I/O

16-23

I/O

24-31

April 2001 Rev. 4

White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520

5962-9461204HUX Related Products

	5962-9461204HUX	5962-9461202HUX
Description	Flash Module, 512KX32, 70ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66	Flash Module, 512KX32, 120ns, CPGA66, 1.075 INCH, CERAMIC, HIP-66
Objectid	1546172070	1900233687
package instruction	1.075 INCH, CERAMIC, HIP-66	1.075 INCH, CERAMIC, HIP-66
Reach Compliance Code	unknown	unknown
Maximum access time	70 ns	120 ns
Other features	USER CONFIGURABLE AS 2M X 8	USER CONFIGURABLE AS 2M X 8
Spare memory width	16	16
JESD-30 code	S-CPGA-P66	S-CPGA-P66
length	27.3 mm	27.3 mm
memory density	16777216 bit	16777216 bit
Memory IC Type	FLASH MODULE	FLASH MODULE
memory width	32	32
Number of functions	1	1
Number of terminals	66	66
word count	524288 words	524288 words
character code	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
organize	512KX32	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL
Programming voltage	5 V	5 V
Certification status	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883
Maximum seat height	4.34 mm	4.34 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	MILITARY	MILITARY
Terminal form	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR
type	NOR TYPE	NOR TYPE
width	27.3 mm	27.3 mm

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