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SSM3J09FU

Description
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type
CategoryDiscrete semiconductor    The transistor   
File Size245KB,5 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Environmental Compliance
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SSM3J09FU Overview

TOSHIBA Field Effect Transistor Silicon P Channel MOS Type

SSM3J09FU Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerToshiba Semiconductor
Parts packaging codeSC-70
package instructionSMALL OUTLINE, R-PDSO-G3
Contacts3
Reach Compliance Codeunknow
ECCN codeEAR99
ConfigurationSINGLE WITH BUILT-IN DIODE AND RESISTOR
Minimum drain-source breakdown voltage30 V
Maximum drain current (Abs) (ID)0.2 A
Maximum drain current (ID)0.2 A
Maximum drain-source on-resistance6 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PDSO-G3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeP-CHANNEL
Maximum power dissipation(Abs)0.15 W
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
SSM3J09FU
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type
SSM3J09FU
Management Switch
High Speed Switching Applications
·
·
Small package
Low on resistance: R
on
= 2.7
(max) (@V
GS
=
−10
V)
: R
on
= 4.2
(max) (@V
GS
=
−4
V)
Unit: mm
Maximum Ratings
(Ta
=
25°C)
Characteristics
Drain-Source voltage
Gate-Source voltage
Drain current
DC
Pulse
Symbol
V
DS
V
GSS
I
D
I
DP
P
D
(Note1)
T
ch
T
stg
Rating
-30
±20
-200
-400
150
150
-55~150
Unit
V
V
mA
mW
°C
°C
Drain power dissipation (Ta
=
25°C)
Channel temperature
Storage temperature
JEDEC
JEITA
SC-70
2-2E1E
Note 1: Mounted on FR4 board
2
(25.4 mm
´
25.4 mm
´
1.6 t, Cu Pad: 0.6 mm
´
3)
Figure 1.
TOSHIBA
Weight: 0.006 g (typ.)
Marking
3
Equivalent Circuit
(top view)
3
Figure 1: 25.4 mm
´
25.4 mm
´
1.6 t,
Cu Pad: 0.6 mm
2
´
3
0.6 mm
DK
1.0 mm
1
2
1
2
Handling Precaution
When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment is
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other
objects that come into direct contact with devices should be made of anti-static materials.
1
2002-01-16
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