REVISIONS
LTR
DESCRIPTION
DATE
(YR-MO-DA)
APPROVED
REV
SHEET
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REV STATUS
OF SHEETS
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SHEET
PREPARED BY
Thomas M. Hess
35
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38
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PMIC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Thomas M. Hess
APPROVED BY
Monica L. Poelking
MICROCIRCUIT, DIGITAL, 32-BIT MICROPROCESSOR
MONOLITHIC SILICON
DRAWING APPROVAL DATE
97-02-05
SIZE
REVISION LEVEL
CAGE CODE
AMSC N/A
A
SHEET
67268
1
OF
38
5962-94578
DESC FORM 193
JUL 94
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E082-97
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V), high
reliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case outlines and
lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation
Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that the device is
appropriate for the application environment.
1.2 PIN. The PIN is as shown in the following example:
5962
-
94578
01
Q
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
Generic number
80502
80502
80502
80502
80502
80502
80502
80502
80502
Circuit function
32-bit Microprocessor
32-bit Microprocessor
32-bit Microprocessor
32-bit Microprocessor
32-bit Microprocessor
32-bit Microprocessor
32-bit Microprocessor
32-bit Microprocessor
32-bit Microprocessor
Temperature Range
-55
o
C to +125
o
C
-40
o
C to +110
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +110
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +110
o
C
-40
o
C to +85
o
C
Speed
50/100 MHz
50/100 MHz
50/100 MHz
60/120 MHz
60/120 MHz
60/120 MHz
66/133 MHz
66/133 MHz
66/133 MHz
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535 with a nontraditional performance
environment 1/
Certification and qualification to MIL-PRF-38535
N
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figures 1
Terminals
296
Package style
Staggered Pin Grid Array
1/
Any device outside the traditional performance environment; e.g., an operating temperature range of -55
C to +125
C and
which requires hermetic packaging.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-94578
SHEET
2
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V or
MIL-PRF-38535, appendix A for device class M.
1.3 Absolute maximum ratings. 2/
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 V Supply Voltage with respect to Ground . . . . . . . . . . . . . . . .
3 V Only Buffer Input Voltage with respect to Ground . . . . . . . . .
5V Safe Buffer Input Voltage with respect to Ground . . . . . . . . .
Lead Temperature (soldering 10 seconds) . . . . . . . . . . . . . . . . .
Thermal Resistance, Junction-to-case (
JC
): Case X . . . . . . . . .
Thermal Resistance, Junction-to-ambient (
JA
): Case X . . . . . .
1.4 Recommended operating conditions.
Case Operating Temperature Range
device type 01, 04 and 07 . . . . . . . . . . . . . . . . . . . . . . . . . . . .
device type 02, 05 and 08 . . . . . . . . . . . . . . . . . . . . . . . . . . . .
device type 03, 06 and 09 . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage, V
CC3
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage, V
CC2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . 97.6 percent
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solitation.
SPECIFICATION
MILITARY
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Microcircuit Case Outlines.
HANDBOOKS
MILITARY
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, bulletin, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
-65
C to +150
C
-65
C to +125
C
-0.5 V dc to +4.1 V dc
-0.5 V dc to Vcc + 0.5 V dc
(not to exceed 4.6 V)
-0.5 V dc to 6.5 V dc
300
C
1.7
C/W 3/
16.2
C/W 3/ 4/
-55
C to +125
C
-40
C to +110
C
-40
C to +85
C
3.135 V dc
<
V
CC
<
3.465 V dc
2.935 V dc
<
V
CC
<
3.265 V dc
2/
3/
4/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Without heat sink.
Zero airflow.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-94578
SHEET
3
2.2 Non Government publications. The following document(s) for a part of this document to the extent specified
herein. Unless otherwise specified, the issues of the documents which are DOD adopted are those listed in the issue
of the DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS
are the issues of the documents cited in the solicitation.
INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)
IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture.
(Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane,
Piscataway, NJ 08854-4150.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents may also be available in or through libraries or other informational
sevices.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accordance with MIL-PRF-
38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in
accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes N, Q, and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Waveform. The waveform shall be as specified on figure 4.
3.2.5 Boundary Scan Instruction Codes. For all devices the boundary scan instruction codes shall be as specified
on figure 5.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating
temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class
M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-94578
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C
T
C
+125°C
3.135 V
V
CC3
3.465 V
2.935 V
V
CC2
3.265 V
unless otherwise specified
TTL level
Applies to all signals
except CLK and PICCLK
TTL level;measured at 4mA
Applies to CLK and PICCLK
only
Measured at 4 mA. Applies to
CLK and PICCLK only
Measured at 3 mA. Applies to
CLK and PICCLK only
0 < V
IN
< = V
CC3
(only for inputs without
pullups or pulldowns)
0 < V
OUT
< = V
CC3
3-state
(only for inputs without
pullups or pulldowns)
V
IN
< = 2.4 V
(only for inputs with pulldowns)
V
IN
< = 0.4 V
(only for inputs with pullups)
100 MHz, 3.465 V 2/
120 MHz, 3.465 V 2/
133 MHz, 3.465 V 2/
Supply current
I
CC2
100 MHz, 3.265 V 2/
120 MHz, 3.265 V 2/
133 MHz, 3.265 V 2/
Capacitance input
Capacitance output
Capacitance I/O
Capacitance CLK input
Capacitance test input
Capacitance test output
Capacitance test clock
Functional tests
See footnotes at end of table.
C
IN
C
O
C
I/O
C
CLK
C
TIN
C
TOUT
C
TCK
See 4.4.1b
See 4.4.1c
4
4
4
4
4
4
4
7,8
1,2,3
Group A
subgroups
Device
type
Min
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
All
All
All
All
All
All
All
2.4
+/-15
µA
-0.3
2.0
-0.3
2.0
Limits
Max
0.8
V
CC
+0.3
0.8
5.55
0.4
V
Unit
Input low voltage
Input high voltage
Input low voltage (5 V)
Input high voltage (5 V)
Output low voltage
Output high voltage
Input leakage current
V
IL3
V
IH3
V
IL5
V
IH5
V
OL3
V
OH3
I
LI
Output leakage current
I
LO
1,2,3
All
+/-15
Input leakage current
Output leakage current
Supply current
I
IH
I
IL
I
CC3
1,2,3
1,2,3
1,2,3
All
All
01,02,03
04,05,06
07,08.09
01,02,03
04,05,06
07,08,09
All
All
All
All
All
All
All
All
200
-400
170
220
255
1885
2300
2575
15
20
25
15
15
20
15
pF
mA
mA
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-94578
SHEET
5
Embedded System
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