Synchronous DRAM Module, 8MX72, 6ns, CMOS, PDMA168
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1164051243 |
| package instruction | DIMM, DIMM168 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 6 ns |
| Maximum clock frequency (fCLK) | 100 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PDMA-N168 |
| JESD-609 code | e1 |
| memory density | 603979776 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE |
| memory width | 72 |
| Humidity sensitivity level | 3 |
| Number of terminals | 168 |
| word count | 8388608 words |
| character code | 8000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8MX72 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM168 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| Maximum standby current | 0.011 A |
| Maximum slew rate | 1.35 mA |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN SILVER COPPER |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
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