EEWORLDEEWORLDEEWORLD

Part Number

Search

MJF122

Description
Complementary Power Darlingtons
CategoryDiscrete semiconductor    The transistor   
File Size107KB,3 Pages
ManufacturerNew Jersey Semiconductor
Websitehttp://www.njsemi.com
Download Datasheet Parametric Compare View All

MJF122 Online Shopping

Suppliers Part Number Price MOQ In stock  
MJF122 - - View Buy Now

MJF122 Overview

Complementary Power Darlingtons

MJF122 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknow
Base Number Matches1
ne.
i,
O
20 STERN AVE.
SPRINGFIELD, NEW JERSEY 07081
U.S.A.
TELEPHONE: (973) 376-2922
(212)227-6005
FAX: (973) 376-8960
MJF122, MJF127
Complementary Power
Darlingtons
For Isolated Package Applications
Designed for general-purpose amplifiers and switching
applications, where the mounting surface of the device is required to
be electrically isolated from the heatsink or chassis.
Features
• Electrically Similar to the Popular TIP122 and TIP127
5.0 A Rated Collector Current
No Isolating Washers Required
Reduced System Cost
High DC Current Gain - 2000 (Min) @ I
c
= 3 Adc
UL Recognized, File #E69369, to 3500 V
RMS
Isolation
Pb-Free Packages are Available*
Rating
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
RMS Isolation Voltage (Note 1)
(t = 0.3 sec, R.H.
<
30%, T
A
= 25°C)
Per Figure 14
Collector Current - Continuous
Peak
Base Current
Total Power Dissipation (Note 2)
@T
C
= 25
D
C
Derate above 25
°C
Total Power Dissipation @ T
A
= 25°C
Derate above 25 °C
Operating and Storage Junction Temperat-
ure Range
Symbol
Value
100
100
5
COMPLEMENTARY SILICON
POWER DARLINGTONS
5.0 A, 100V, 30 W
NPN
PNP
COLLECTOR 2
COLLECTOR 2
MAXIMUM RATINGS
Unit
Vdc
Vdc
Vdc
VRMS
EMITTER 3
MJF122
EMITTER 3
MJF127
VCEO
VCB
VEB
VISOL
MARKING
DIAGRAM
4500
TO-220
Ic
IB
PD
5
8
0.12
30
0.24
Adc
Adc
W
W/°C
W
W/°C
= Assembly Location
= Year
= WorkWeek
PD
Tj, T
st
g
2
0.016
-65 to
+ 150
Ic
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 2)
Lead Temperature for Soldering Purpose
Symbol
R
(UA
Max
62.5
4.1
Unit
RBJC
°c/w
°c/w
260
°c
T
L
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Proper strike and creepage distance must be provided.
2. Measurement made with thermocouple contacting the bottom insulated
mounting surface (in a location beneath the die), the device mounted on a
heatsink with thermal grease and a mounting torque of > 6 in. Ibs.
Quality Semi-Conductors

MJF122 Related Products

MJF122 MJF127
Description Complementary Power Darlingtons Complementary Power Darlingtons
Reach Compliance Code unknow unknow
Base Number Matches 1 1
British design of solar charging clothes to charge portable devices
When people travel, it is troublesome to find a power source to charge their mobile phones, MP3 and other portable devices. The British Broadcasting Corporation reported on the 25th that British resea...
songbo Power technology
LPC2478 program runs internally, some files are placed externally
My LPC2478 board has an internal 512K FLASH for running programs and an external NOR FLASH for storing data. Now the startup LOGO is too big to fit in 512. I want to put the program directly into the ...
liuxiaosheng Embedded System
[Xunwei Electronics] Samsung development board iTOP-4412 programming system steps
I just bought a Xunwei iTOP-4412 development board + 5 million camera module. Here are the steps to burn the image: You need to prepare a TF card first and burn U-BOOT to the TF card first. Please fol...
lina_90 ARM Technology
There are so many colons in command.bib in wince
Why are there so many colons in comman.bib? They block so many things, for example: ; @CESYSGEN IF FONTS_ARIALBD_1_08 ; arialbd.ttf $(_WINCEROOT)\public\common\oak\files\arialbd_1_08.ttf NK SHU ; @CES...
hero362631780 Embedded System
Robot-FPGA-Embedded-MCU Exchange Group: 78603131
Technical exchange, common progress, everyone is welcome to join!...
ljs183 Robotics Development
Disk read and write buffer issues
I modified ramdisk to make a virtual disk (the device is a storage device with PCI interface, which can save data after power failure), but when the file was written (the file copy progress dialog dis...
atom1212 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1072  941  2274  1930  2436  22  19  46  39  50 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号