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BU-63925F2-120

Description
Mil-Std-1553 Controller, CMOS, CDFP70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size983KB,48 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric View All

BU-63925F2-120 Overview

Mil-Std-1553 Controller, CMOS, CDFP70

BU-63925F2-120 Parametric

Parameter NameAttribute value
Objectid1334450454
Reach Compliance Codecompliant
JESD-30 codeR-XDFP-F70
Number of terminals70
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL70,1.0
Package shapeRECTANGULAR
Package formFLATPACK
power supply5,-12 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
BU-63825
SPACE LEVEL MIL-STD-1553
BC/RT/MT
ADVANCED COMMUNICATION ENGINE
(SP’ACE II) TERMINAL
FEATURES
Make sure the next
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has...
®
®
Direct Replacement for BU-61582
and BU-61583
Radiation Tolerant & Radiation
Hardened Versions
Fully Integrated 1553 Terminal
Flexible Processor Interface
16K x 16 Internal RAM
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Intelligent RT Data Buffering
Ceramic Package
DESCRIPTION
The BU-63825(925) is a fully hardware & software compatible, direct
drop-in replacement for the BU-61582(83).
DDC’s BU-63825(925) Space Advanced Communication Engine
(Sp’ACE II) is a radiation hardened version of the BU-61580(81) ACE
terminal. DDC supplies the BU-63825 with enhanced screening for
space and other high reliability applications.
The BU-63825 provides a complete integrated BC/RT/MT interface
between a host processor and a MIL-STD-1553 bus. The
BU-63825(925) provides functional and software compatibility with
the standard BU-61580(81) product and is packaged in the same 1.9
square-inch package footprint.
As an option, DDC can supply the BU-63825 with space level screen-
ing. This entails enhancements in the areas of element evaluation
and screening procedures for active and passive elements, as well as
the manufacturing and screening processes used in producing the
terminals.
The BU-63825 integrates dual transceiver, protocol, memory man-
agement and processor interface logic, and 16K words of RAM in the
choice of 70-pin DIP or flat pack packages. Transceiverless versions
may be used with an external electrical or fiber optic transceiver.
To minimize board space and ‘glue’ logic, the Sp’ACE II terminals
provide flexibility in interfacing to a host processor and internal/exter-
nal RAM.
Multiple Ordering Options;
+5V (Only)
+5V/-15V
+5V/-12V
+5V/Transceiverless
+5V (Only, with Transmit Inhibits)
WARNING: EXPORT CONTROLLED PRODUCT
This data sheet or product brief consists of Data De-
vice Corporation general product information that does
not contain controlled technical data as defined in the
International in Arms Regulations (ITAR) Part 120.10 or
Export Administration Regulations (EAR) Part 734.7-11.
The technology described herein is controlled under the
EAR and may not be exported without proper authoriza-
tion by the U.S. Department of Commerce as determined
on a case by case basis.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7677 or 7381
7771
All trademarks are the property of their respective owners.
© 2005 Data Device Corporation
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