1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS
MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS
THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
MIN
0.70
0.00
0.25
1.40
0.90
0.35
MILLIMETERS
NOM
MAX
0.75
0.80
0.05
0.20 REF
0.30
0.35
2.00 BSC
1.50
1.60
2.00 BSC
1.00
1.10
1.30 BSC
0.35 REF
0.40
0.45
MIN
0.028
0.000
0.010
INCHES
NOM
0.030
MAX
0.031
0.002
0.014
0.063
0.043
0.018
2X
0.10 C
2X
0.10 C
0.10 C
8X
0.08 C
SEATING
PLANE
A1
2X
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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For additional information, please contact your local
Sales Representative
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
D2
e
1
E
0.008 REF
0.012
0.079 BSC
0.059
0.055
0.079 BSC
0.039
0.035
0.051 BSC
0.014 REF
0.014
0.016
TOP VIEW
SOLDERING FOOTPRINT*
A
(A3)
C
0.250
1.100
2
1.300
2X
0.400
0.600
SIDE VIEW
e/2
0.400
1.600
0.300
L
K
0.275
E2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
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