EEWORLDEEWORLDEEWORLD

Part Number

Search

GRM0335C1H5R6DA01

Description
Capacitance
File Size101KB,3 Pages
ManufacturerMurata
Websitehttps://www.murata.com
Download Datasheet View All

GRM0335C1H5R6DA01 Overview

Capacitance

GRM0335C1H5R6DA01#
# indicates a package specification code.
< List of part numbers with package codes >
GRM0335C1H5R6DA01D , GRM0335C1H5R6DA01W , GRM0335C1H5R6DA01J
Shape
References
Packaging
Specifications
φ180mm Paper taping
φ330mm Paper taping
φ180mm Paper taping (W8P1*)
* Width : 8mm, Pocket pitch : 1mm
Minimum quantity
15000
50000
30000
L size
W size
T size
External terminal width e
Distance between external terminals g
Size code in inch(mm)
0.6 ±0.03mm
1 piece
0.3 ±0.03mm
φ180mm Reel
0.3 ±0.03mm
0.1 to 0.2mm
0.2mm min.
0201 (0603)
Mass (typ.)
0.33mg
118g
Specifications
Capacitance
Rated voltage
Temperature characteristics (complied standard)
Temperature coefficient
Temperature range of temperature characteristics
Operating temperature range
5.6pF ±0.5pF
50Vdc
C0G(EIA)
0±30ppm/℃
25 to 125℃
-55 to 125℃
1 of 2
1.This datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. Therefore, it s specifications are subject to change or our products in it may be discontinued
without advance notice. Please check with our sales representatives or product engineers before ordering.
2.This datasheet has only typical specifications because there is no space for detailed specifications.
Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
URL : http://www.murata.com/
Last updated: 2015/12/01
Samsung Electronics China Research Institute [Recruitment] LTE/LTE-A DSP Development Engineer
[b]【Recruitment】Samsung Electronics China Research Institute Recruitment LTE/LTE-A DSP Development Engineer[/b] Job Description - Responsible for the development of DSP on the base station side (inclu...
Samsung_syslab Talking about work
Embedded Software Engineering
Headhunter position [Guangzhou] Job responsibilities: 1. Participate in project demand analysis, responsible for embedded system development and verification, MCU bottom-level driver writing, control ...
ff318421749 Recruitment
The MSP430 Application UART driver cannot be installed
What should I do? What should I do? ! ! ! !...
budongshi Microcontroller MCU
Introduction to the latest wireless charging technology for electric vehicles at ORNL laboratory in the United States
[i=s]This post was last edited by alan000345 on 2018-6-29 14:10[/i] The Oak Ridge National Laboratory in Tennessee, USA, demonstrated the world's first 20-kilowatt wireless charging system for electri...
alan000345 Automotive Electronics
STM32 IO port driver help
Now we need to use STM32 to drive 74HC245 -----245 is powered by 5V....
908508455a stm32/stm8
About PCB layout of decoupling capacitors
[size=4] Decoupling capacitors are usually placed after each node in the circuit, close to the unit power supply position, the closer the better. According to the operating frequency and power consump...
qwqwqw2088 PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2118  1561  979  2607  1556  43  32  20  53  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号