WIREWOUND CHIP INDUCTORS
1. PART NO. EXPRESSION :
SDI565047 SERIES
SDI565047-R12MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : R12 = 0.12uH
(d) Tolerance code : K = ±10%, M = ±20%
(e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
B
E
F
E
I
J
I
C
PCB Pattern
Unit:m/m
A
5.7±0.3
B
5.0±0.3
C
4.7±0.3
E
1.3 Min.
F
1.7 Min.
H
5.0 Ref.
I
2.0 Ref.
J
2.0 Ref.
3. SCHEMATIC :
1
2
4. GENERAL SPECIFICATION :
a) Ambient temp. : 20°C
b) Operating temp. : -25°C to 85°C
c) Rated current : Base on temp. rise & L/L0A=10% Max.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
WIREWOUND CHIP INDUCTORS
5. ELECTRICAL CHARACTERISTICS :
Part No.
SDI565047-R12 F
SDI565047-R27 F
SDI565047-R47 F
SDI565047-1R0 F
SDI565047-1R5 F
SDI565047-2R2 F
SDI565047-3R3 F
SDI565047-4R7 F
SDI565047-6R8 F
SDI565047-100 F
SDI565047-150 F
SDI565047-220 F
SDI565047-330 F
SDI565047-470 F
SDI565047-680 F
SDI565047-101 F
SDI565047-151 F
SDI565047-221 F
SDI565047-331 F
SDI565047-471 F
SDI565047-681 F
SDI565047-102 F
SDI565047-222 F
SDI565047-472 F
SDI565047-103 F
Inductance tolerance :
: J : ±5%
K : ±10%
M : ±20%
Tolerance
M
M
M
M
M
M
M
M
M
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
M, K
Inductance
( uH )
0.12
0.27
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
330
470
680
1000
2200
4700
10000
Test
Frequency
( Hz )
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
1M
100K
100K
100K
100K
100K
100K
10K
10K
10K
10K
SRF
( MHz )
Min.
450
300
200
150
110
80
40
30
25
20
17
15
12
10
7.6
6.5
5.0
4.0
3.1
2.4
1.9
1.7
1.2
0.8
0.5
SDI565047 SERIES
DCR
( )
Max.
0.0098
0.0140
0.0182
0.0270
0.0310
0.0410
0.0500
0.0574
0.1040
0.1300
0.210
0.266
0.448
0.560
0.938
1.204
2.660
3.360
6.160
7.560
11.34
14.42
30.10
61.04
140.0
IDC
( mA )
Max.
6000
5300
4800
4000
3700
3200
2900
2700
2000
1700
1400
1200
900
800
640
560
420
320
270
240
190
150
100
70
50
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
WIREWOUND CHIP INDUCTORS
6. RELIABILITY AND TEST CONDITION :
SDI565047 SERIES
ITEM
Environmental Tests
High Temperature Storage Test
Reference documents:
MIL-STD-202G Method 108A
PERFORMANCE
TEST CONDITION
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Temperature : 85±2°C
Time : 96±2 hours
Tested after 1 hour (less than 2 hours) at room temperature
Temp
85°C
Room
Temp
0
High temperature
1H
96H Test Time
Low Temperature Storage Test
Reference documents:
IEC 68-2-1A 6.1 6.2
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Temperature : -25±2°C
Time : 96±2 hours
Tested after 1 hour (less than 2 hours) at room temperature
Room
Temp
0
-25°C
Temp
Low temperature
96H
Test
Time
Humidity Test
Reference documents:
MIL-STD-202G Method 103B
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Dry oven at temperature of 40±5°C for 24 hours
Measured after 24 hours
Exposure : Temperature : 40±2°C, Humidity : 93±3% RH,
Time : 96±2 hours
Tested while the specimens are still in the chamber
Tested after 1 hour (less than 2 hours) at room temperature
40°C
93%RH
Temp & Humidity
High temperature
High humidity
Room
Conditions
1H
0
96H Test
Time
Thermal shock test
Reference documents:
MIL-STD-202G Method 107G
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
T : weight< 28g : 15 Min.
28g<weight<136g : 30 Min.
Conditions of 1 cycle :
Step 1 : -40°C for T time
Step 2 : 125°C for T time
Total : 20 cycles
Temp
125°C
Room
Temp
0
-40°C
T
Time
Change time < 5 min
T
Physical Characteristics Tests
Solderability Test
Reference documents:
MIL-STD-202G Method 208H
IPC J-STD-002B
More than 95% of termincal electrode should
be covered with solder.
Solder temperature : 245±5°C
Dip time : 5 secs.
Solder : Sn(63)/Pb(37)
Flux : rosin flux
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
WIREWOUND CHIP INDUCTORS
6. RELIABILITY AND TEST CONDITION :
SDI565047 SERIES
ITEM
Heat Endurance of
Reflow Soldering
Reference documents:
IPC J-STD-020B
PERFORMANCE
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
TEST CONDITION
Refer to reflow curve.
No. of cycle : 3
Peak temp. : 245±5°C
Vibration Test
Reference documents:
MIL-STD-202G Method 201A
Frequency : 10~55Hz
Amplitude : 0.75mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Freq
55Hz
10Hz
1Min
Time
Drop Test
Reference documents:
MIL-STD-202G Method 203C
1. No case deformation or change in appearance.
2. L/L<30% (Closed Magnetic Circuit)
L/L<10%
3. Q/Q < 30%
4. DCR/DCR<10%
Pulling Test :
A : Sectional area of terminal
Drop from a height of 1m with 981m/s² (100G) altitude
(1 angle, 1 ridge and 2 surface orientations)
Terminal Strength Push Test
Reference documents:
JIS C 5321:1997
Bend PCB at middle point, the deflection shall be 2mm.
Pulling Test :
Force
A<8mm²
8mm²<A<20mm²
20mm²<A
>5N
>10N
>20N
Time (sec)
30
10
10
X
Bending Test :
R0.5
1.0
Y
Bending Test : The terminal electrode & the
dielectric must not be damaged by the forces
applied on the right conditions.
Sample
Reflow Curve
300
250
270
200
150
100
50
Preheat
Ramp-up
Peak
Ramp-down
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
WIREWOUND CHIP INDUCTORS
7. SOLDERING AND MOUNTING :
7-1. Recommended PC Board Pattern
3.00
2.00
3.00
SDI565047 SERIES
7-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
7-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
7-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave, typical at 240°C. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
is shown in Figure 2.
7-2.3 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
Soldering
Natural
cooling
Preheating
Soldering
Natural
cooling
TEMPERATURE °C
3.50
230
150
TEMPERATURE °C
Over
1min.
Over
1min.
Gradual Cooling
Within 10secs.
250
230
150
Over 2mins.
Gradual Cooling
Within 3secs.
Preheating
Soldering
TEMPERATURE °C
Figure 1. Re-flow Soldering
280
230
150
Natural
cooling
Figure 2. Wave Soldering
Over 1min.
Gradual Cooling
Within 3secs.
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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