FIFO, 4KX9, 35ns, Asynchronous, CMOS, CDIP28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1156949125 |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 35 ns |
| Maximum clock frequency (fCLK) | 22.2 MHz |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| memory density | 36864 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of terminals | 28 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4KX9 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.008 A |
| Maximum slew rate | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
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