Ordering Information .................................................................................................................................................................... 2
7.1. User Programming Interface ..................................................................................................................................... 19
7.2. Start-up output frequency and signaling types .......................................................................................................... 19
8.1. Any-frequency function ............................................................................................................................................. 20
C/SPI Control Registers...................................................................................................................................................... 30
9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 30
9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 31
9.3. Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 32
9.4. Register Address: 0x03. Frac-N PLL Integer Value and Frac-N PLL Fraction MSW ................................................ 33
9.6. Register Address: 0x05. PostDiv, Driver Control ...................................................................................................... 34
9.7. Register Address: 0x06. mDriver, Driver Control ...................................................................................................... 35
10 I
2
C Operation ........................................................................................................................................................................ 36
10.1. I
2
C protocol ............................................................................................................................................................... 36
10.2. I
2
C Timing Specification ............................................................................................................................................ 39
10.3. I
2
C Device Address Modes ....................................................................................................................................... 40
Dimensions and Patterns ........................................................................................................................................................... 47
Additional Information ................................................................................................................................................................ 48
Revision History ......................................................................................................................................................................... 49
Rev 1.00
Page 3 of 49
www.sitime.com
SiT3542
340 to 725 MHz Endura™ Series I
2
C/SPI Programmable Oscillator
1 Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Symbol
f
Min.
340.000001
340.000001
Typ.
–
–
Max.
725.000000
500.000000
Unit
MHz
MHz
Condition
LVDS and LVPECL output driver, factory or user
programmable, accurate to 6 decimal places
HCSL output driver, factory or user programmable, accurate to
6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations
Frequency Range
Frequency Stability
Frequency Stability
F_stab
-20
-20
-25
-50
First Year Aging
F_1y
–
–
–
–
–
±1
–
–
–
+20
+20
+25
+50
–
ppm
ppm
ppm
ppm
ppm
1
st
-year aging at 25°C
Temperature Range
Operating Temperature Range
T_use
-20
-40
-40
+70
+85
+105
°C
°C
°C
Extended Commercial
Industrial
Extended Industrial. Available only for I
2
C operation, not SPI.
Rugged Characteristics
Acceleration (g) sensitivity,
Gamma Vector
Supply Voltage
F_g
–
–
0.1
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
3.3
3.0
2.8
2.5
–
–
100
–
–
–
3.63
3.3
3.08
2.75
–
30%
–
V
V
V
V
ppb/g
Low sensitivity grade; total gamma over 3 axes; 15 Hz to
2 kHz; MIL-PRF-55310, computed per section 4.8.18.3.1
Input Characteristics – OE Pin
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
VIH
VIL
Z_in
70%
–
–
Vdd
Vdd
kΩ
OE pin
OE pin
OE pin, logic high or logic low
Output Characteristics
Duty Cycle
DC
45
–
–
55
%
Startup and Output Enable/Disable Timing
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
T_start
T_oe_hw
3.0
9.1
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
T_oe_sw
–
–
11.8
µs
Rev 1.00
Page 4 of 49
www.sitime.com
SiT3542
340 to 725 MHz Endura™ Series I
2
C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.10
–
94
63
–
30
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B
T_jitt
–
0.22
0.075
0.23
0.09
1
0.260
0.085
0.325
0.095
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
89
67
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
340
530
50
1.375
50
460
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.060
0.21
0.070
1
0.255
0.070
0.320
0.80
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
mV
mV
V
mV
ps
f = 622.08 MHz. See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
This example program downloads the GPIO TOGGLE in the control SUITEz to the RAM of 28027 through SCI and runs. There are 4 files in the attachment. First, compile the target code in CCS to generate tw...
I bought a CC2640R2 LaunchPad based on the promotion. When I placed the order, I was about to pay, but I couldn’t find a place to enter the discount code. Fortunately, I found a Chinese ordering tutor...
Well, I spent some time on the weekend and added two AT commands today: AT+RTCS=--------Used for RTC calibration and query AT+FRAM=--------FRAM-LOG log for PM2.5 data, supports 2880 logs with time sta...
Thank you for being here, thank you EEWORLD Admin-okhxyyo and Orange Kai
The fourth Thursday of November is Thanksgiving Day! Although it is a foreign holiday, I would like to take this opportunity to...
How to read the written data of RL78 Flash Self-Programming Library? I am new to Renesas MCU, hope you can give me some advice, thank you very much!!!...
1. Introduction
RFID (radio frequency identification) is a non-contact automatic identification technology that emerged in the 1990s. It uses the characteristics of radio frequency signal prop...[Details]
China's new energy vehicles are in a transition period from research and development to real industrial development. In 2012, with the intensive launch of new energy vehicle policy planning, the de...[Details]
1. Introduction
Since the 1980s, with the continuous development of automotive electronic technology, there are more and more electronic control units in automobiles, such as electronic fuel i...[Details]
Electronic systems are located at different points on the automotive power bus and therefore often need to operate under very stringent power requirements. These include load dump, cold crank, very lo...[Details]
1 Introduction
As an emerging microfabrication technology, micro-electromechanical system (MEMS) technology has begun to be applied in various fields. It can integrate functions such as inform...[Details]
introduction
The emergence of high-performance, low-power embedded CPUs and high-reliability network operating systems has made it possible to implement applications with large amounts of comp...[Details]
1 Introduction
Water resources are the basic conditions for human survival and the lifeline of economic development. The reality shows that due to the global shortage of water resources and th...[Details]
1. Introduction
Testing the temperature of steel billets before rolling is an important measure to ensure the quality of steel. Traditional manual testing is difficult to ensure product qu...[Details]
Flooded Batteries
This battery developed in Germany can be used to power flashlights, strobe lights and toys as long as it is filled with water. This battery can be stored for 50 years and can...[Details]
Introduction
Liquid crystal, as a display device, is widely used in low-power products such as instruments, meters, and electronic equipment with its unique advantages. In the past, the displ...[Details]
Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
LED lighting: Basic circuit design can be completed in as little as one day
Semiconductor manufacturers are also getting involved in the LED lighting business. The power circuit of LED req...[Details]
0 Introduction
High-precision current source can provide high-precision current supply for precision instruments, and is suitable for automatic measurement tasks of various resistors in semico...[Details]
Currently, each country is developing its own USB interface
charging specifications
, which leads to a major problem that a USB interface
charging
device manufactured in one country...[Details]