YENYO
1.
封裝
Package
封裝方式
Method: SMAF
封裝尺寸
Dimension:
如圖示
S1AF THRU S1MF
1.0A General Purpose Rectifier
2.
產品特色
Features
Low Forward voltage drop
Easy pick and place
High temperature soldering: 260℃/10 seconds at terminals
Ultra thin profile package for space constrained utilization
Package suitable for automated handling
Glass passivated chip junction
For surface mounted applications in order to optimize board space
Lead‐free & halogen‐free parts, RoHS compliant
Epoxy: UL94V‐0 rated flame retardant
Case: Molded Plastic
Terminals: Solder plated solderable per MIL‐STD‐750 Method 2026
Mounting position: Any
Polarity: Color band denotes cathode end
3.
機械數據
Mechanical Data
單½
Unit: millimeters
4.
極限值與電參數
Maximum Ratings & Electrical Characteristic
Rating at 25
O
C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or
inductive load. For capacitive load, derate current by 20%.
PARAMETER
Repetitive Peak Reverse Voltage
RMS Voltage
DC Blocking Voltage
Average Forward Current
Peak Forward Surge Current :8.3ms single half
sine‐wave superimposed on rated load
Forward voltage at 1.0A
DC Reverse Current
DC blocking voltage
Typical thermal resistance, Junction to lead(Note 1)
Junction to ambient (Note 1)
Operating junction temperature and storage
temperature range
T
J
=25 C
O
Symbol
V
RRM
V
RMS
V
R
I
F(AV)
I
FSM
V
F
I
R
R
θJL
R
θJA
T
J
, T
STG
S1AF
50
35
50
S1BF
100
70
100
S1DF
200
140
200
S1GF
400
280
400
1.0
30.0
1.1
S1JF
600
420
600
S1KF
800
560
800
S1MF
1000
700
1000
UNITS
Volts
Volts
Volts
Amps
Amps
Volts
3
20
83
‐55 to +150
uA
O
C/W
O
C
Notes:
(1) Mounted on 48 cm
2
FR‐4 PCB.
1/2
R2,JUL-15
YENYO
S1AF THRU S1MF
1.0A General Purpose Rectifier
5.
特性曲線
Rating & Characteristic Curves
Fig. 1 Forward Current Derating Curve
Fig. 2 Typical Reverse Characteristics
Fig. 3 Typical Forward Characteristics
2/2
R2,JUL-15
Embedded System
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