Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IHW30N110R3
MA000853768
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
3.660
0.530
0.159
529.068
8.138
19.996
379.925
1599.686
31.874
29.065
0.253
0.632
1.642
1.033
3.442
3438.006
Average
Mass
[%]
0.06
0.01
0.00
8.75
0.13
0.33
6.28
26.45
0.53
0.48
0.00
0.01
0.03
0.02
0.06
56.86
29. August 2013
6047.11 mg
Sum
[%]
0.06
Average
Mass
[ppm]
605
88
26
8.76
0.13
87491
1346
3307
62828
33.06
0.53
0.48
264537
5271
4806
42
104
0.04
272
171
569
56.94
568537
569277
1000000
418
330672
5271
4806
87605
1346
Sum
[ppm]
605
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
51mcu
京公网安备 11010802033920号
EEWORLD
