Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BCR 553 E6327
MA000238832
PG-SOT23-3-4
Material Group
non noble metal
noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
arsenic
gold
silicon
chromium
silicon
titanium
copper
gold
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-38-2
7440-57-5
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-57-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.013
0.112
0.009
0.001
0.003
3.001
0.021
0.091
0.136
0.170
1.419
3.861
0.136
0.110
Average
Mass
[%]
0.00
0.14
1.23
0.10
0.01
0.03
33.04
0.23
1.00
1.50
1.88
15.63
42.50
1.50
1.21
29. August 2013
9.08 mg
Sum
[%]
Average
Mass
[ppm]
15
1438
1.37
12283
995
66
332
33.18
0.23
330382
2313
10001
15002
18752
156270
62.51
1.50
1.21
425054
15019
12078
625079
15019
12078
1000000
331775
2313
13736
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
EEWORLD
