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MA001041562

Description
Material Content Data Sheet
File Size24KB,1 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
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MA001041562 Overview

Material Content Data Sheet

Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC010N04LS
MA001041562
PG-TDSON-8-17
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.517
0.038
0.011
37.762
0.044
0.086
6.079
36.646
1.452
0.166
0.053
0.042
2.010
0.003
0.013
0.269
10.909
0.007
0.026
0.529
21.482
Average
Mass
[%]
1.27
0.03
0.01
31.69
0.04
0.07
5.10
30.76
1.22
0.14
0.04
0.04
1.69
0.00
0.01
0.23
9.16
0.01
0.02
0.44
18.03
29. August 2013
119.15 mg
Sum
[%]
1.27
Average
Mass
[ppm]
12735
317
95
31.73
0.04
316939
373
719
51023
35.93
1.22
0.14
307577
12184
1389
442
353
1.77
16874
28
113
2255
9.40
91561
56
222
4441
18.50
180304
185023
1000000
93957
17669
359319
12184
1389
317351
373
Sum
[ppm]
12735
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
< 10%
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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