Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPG20N06S2L-65A
MA001031880
PG-TDSON-8-10
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.879
0.046
0.014
46.380
0.716
0.090
6.415
38.671
1.396
0.001
0.603
0.058
0.046
2.209
Average
Mass
[%]
1.91
0.05
0.01
47.07
0.73
0.09
6.51
39.25
1.42
0.00
0.61
0.06
0.05
2.24
29. August 2013
98.53 mg
Sum
[%]
1.91
Average
Mass
[ppm]
19070
471
141
47.13
0.73
470746
7263
917
65111
45.85
1.42
392498
14173
15
0.61
6121
587
469
2.35
22418
23474
1000000
6136
458526
14173
471358
7263
Sum
[ppm]
19070
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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