SN74LVC2G06YZPR datasheet, PDF

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SN74LVC2G06YZPR: DescriptionDual Inverter Buffer/Driver with Open-Drain Output 6-DSBGA -40 to 85; Categorylogic logic; File Size2MB，30 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74LVC2G06YZPR Overview

Dual Inverter Buffer/Driver with Open-Drain Output 6-DSBGA -40 to 85

SN74LVC2G06YZPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA, BGA6,2X3,20
Contacts	6
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
series	LVC/LCX/Z
JESD-30 code	R-XBGA-B6
JESD-609 code	e1
length	1.4 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	INVERTER
MaximumI(ol)	0.032 A
Humidity sensitivity level	1
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	OPEN-DRAIN
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA6,2X3,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Maximum supply current (ICC)	0.01 mA
Prop。Delay @ Nom-Su	3.4 ns
propagation delay (tpd)	7.2 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm
Base Number Matches	1

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Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	-	Lead free	-	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments
Parts packaging code	BGA	SOT-23	SOT-23	SOIC	-	SON	SON
package instruction	VFBGA, BGA6,2X3,20	SOT-23, 6 PIN	LSSOP, TSOP6,.11,37	TSSOP, TSSOP6,.08	-	VSON, SOLCC6,.04,20	VSON, SOLCC6,.04,14
Contacts	6	6	6	6	-	6	6
Reach Compliance Code	compli	compli	compli	compli	-	compli	compli
Factory Lead Time	1 week	6 weeks	-	6 weeks	-	6 weeks	6 weeks
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	-	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-XBGA-B6	R-PDSO-G6	R-PDSO-G6	R-PDSO-G6	-	R-PDSO-N6	S-PDSO-N6
JESD-609 code	e1	e4	e4	e4	-	e4	e4
length	1.4 mm	2.9 mm	2.9 mm	2 mm	-	1.45 mm	1 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	-	50 pF	50 pF
Logic integrated circuit type	INVERTER	INVERTER	INVERTER	INVERTER	-	INVERTER	INVERTER
MaximumI(ol)	0.032 A	0.032 A	0.024 A	0.032 A	-	0.032 A	0.032 A
Humidity sensitivity level	1	1	1	1	-	1	1
Number of functions	2	2	2	2	-	2	2
Number of entries	1	1	1	1	-	1	1
Number of terminals	6	6	6	6	-	6	6
Maximum operating temperature	85 °C	125 °C	125 °C	125 °C	-	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	-	OPEN-DRAIN	OPEN-DRAIN
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	LSSOP	LSSOP	TSSOP	-	VSON	VSON
Encapsulate equivalent code	BGA6,2X3,20	TSOP6,.11,37	TSOP6,.11,37	TSSOP6,.08	-	SOLCC6,.04,20	SOLCC6,.04,14
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TR	TR	TR	TR	-	TR	TR
Peak Reflow Temperature (Celsius)	260	260	260	260	-	260	260
power supply	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V
Maximum supply current (ICC)	0.01 mA	0.01 mA	-	0.01 mA	-	0.01 mA	0.01 mA
Prop。Delay @ Nom-Su	3.4 ns	3.9 ns	-	3.9 ns	-	3.9 ns	3.9 ns
propagation delay (tpd)	7.2 ns	7.2 ns	7.2 ns	7.2 ns	-	7.2 ns	7.2 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	-	NO	NO
Maximum seat height	0.5 mm	1.45 mm	1.45 mm	1.1 mm	-	0.6 mm	0.4 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V	-	1.65 V	1.65 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	-	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	BALL	GULL WING	GULL WING	GULL WING	-	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.95 mm	0.95 mm	0.65 mm	-	0.5 mm	0.35 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	0.9 mm	1.6 mm	1.6 mm	1.25 mm	-	1 mm	1 mm

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