FDC2212DNTT datasheet, PDF - EEWORLD Datasheet

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FDC2212DNTT: DescriptionNoise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125; CategoryAnalog mixed-signal IC The signal circuit; File Size2MB，60 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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FDC2212DNTT Overview

Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125

FDC2212DNTT Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SON
package instruction	WSON-12
Contacts	12
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	6 weeks
Samacsys Description	Proximity Sensors EMI-Resistant 28-Bit Capacitance to Digital Converter for Proximity and Level Sensing 12-WSON -40 to 125
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT
JESD-30 code	S-PDSO-N12
JESD-609 code	e3
length	4 mm
Humidity sensitivity level	1
Number of channels	4
Number of functions	1
Number of terminals	12
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Package shape	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Maximum seat height	0.8 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
total dose	9-Sep-19 V
width	4 mm
Base Number Matches	1

FDC2212DNTT Related Products

	FDC2212DNTT	FDC2112DNTR	FDC2112DNTT	FDC2114RGHR	FDC2114RGHT	FDC2212DNTR	FDC2214RGHR
Description	Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125	Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125	Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125	Noise-immune Capacitive Sensing Solution for Proximity Sensing 16-WQFN -40 to 125	Noise-immune Capacitive Sensing Solution for Proximity Sensing 16-WQFN -40 to 125	Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125	Noise-immune Capacitive Sensing Solution for Proximity Sensing 16-WQFN -40 to 125
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	-	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	conform to
Maker	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments	-	Texas Instruments
Parts packaging code	SON	SON	SON	QFN	QFN	-	QFN
package instruction	WSON-12	HVSON,	HVSON,	HVQCCN,	HVQCCN,	-	HVQCCN,
Contacts	12	12	12	16	16	-	16
Reach Compliance Code	compliant	compli	compli	compli	compli	-	compli
Factory Lead Time	6 weeks	6 weeks	6 weeks	6 weeks	6 weeks	-	6 weeks
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	ANALOG CIRCUIT	-	ANALOG CIRCUIT
JESD-30 code	S-PDSO-N12	S-PDSO-N12	S-PDSO-N12	S-PQCC-N16	S-PQCC-N16	-	S-PQCC-N16
JESD-609 code	e3	e3	e3	e3	e3	-	e3
length	4 mm	4 mm	4 mm	4 mm	4 mm	-	4 mm
Humidity sensitivity level	1	1	1	1	1	-	1
Number of channels	4	4	4	4	4	-	4
Number of functions	1	1	1	1	1	-	1
Number of terminals	12	12	12	16	16	-	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	-	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	HVSON	HVSON	HVSON	HVQCCN	HVQCCN	-	HVQCCN
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	-	260
Maximum seat height	0.8 mm	1 mm	1 mm	0.8 mm	0.8 mm	-	0.8 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	-	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V
surface mount	YES	YES	YES	YES	YES	-	YES
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	-	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
total dose	9-Sep-19 V	9-Sep-19 V	9-Sep-19 V	9-Sep-19 V	9-Sep-19 V	-	9-Sep-19 V
width	4 mm	4 mm	4 mm	4 mm	4 mm	-	4 mm

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