UMB2F THRU UMB10F
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS
Voltage Range - 200 to 1000 Volts Current - 0.5/0.8 Ampere
FEATURES
MECHANICAL DATA
Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
g
p
Low leakage current
High forward surge capability
High temperature soldering
：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
●
Case:SOF2-4
Molded plastic
over glass passivated chip
Terminals:
Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity:
Polarity symbols marked on body
●
●
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.
MDD Catalog Number
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=30
On glass-epoxy P.C.B.
On aluminum substrate
Peak forward surge current,
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage drop
per leg at 0.4A
Maximum DC reverse current
at rated DC blocking voltage
T
J
=25
T
J
=125
SYMBOLS
UMB2F
B3
200
140
200
V
RRM
V
RMS
V
DC
I
F(AV)
UMB4F
B4
400
280
400
UB6F
B5
600
420
600
0.5
UB8F
B6
800
560
800
UMB10F
B7
1000
700
1000
UNITS
VOLTS
VOLTS
VOLTS
Amps
0.8
I
FSM
20
Amps
V
F
I
R
R
θJA
(1)
R
θJA
(2)
1.1
5.0
100
100
80
30
-55 to +150
-55 to +150
Volts
uA
uA
/W
/W
Thermal resistance from junction to
ambientper leg
Typical thermal resistance per leg
Operating temperature range
storage temperature range
R
JL
T
J
T
STG
NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads
2.On aluminum substrate P.C.B. with on area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad
RATINGS AND CHARACTERISTIC CURVES UMB2F THRU UMB10F
Fig.1 Forward Current
Derating Curve
A
Average Forward Current (A
A)
1
Peak Forward Surge
Current(A)
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
Amibant Temperature(℃)
150
Glass Epoxy P.C.B
Al Substrate
Fig.2 Maximum Non-Repetitive Peak
Forward Surge Current
20
15
8.3mS single half
sine-wave
10
5
0
1
10
Number of Cycles at 60Hz
100
Fig.3 Typical I t t
Fi 3 T i l Instantaneous Forward
F
d
Characteristics
Instantaneous Reverse Leakage
s
Cur
rrent(μA)
10
Instanta
aneous Forward
C
Current(A)
Fig.4
Fig 4 Typical Reverse Leakage
Characteristics
10
Tj=125℃
1
1
Tj=75℃
0.1
Tj=25℃
Pulse With=300μS
1%Duty Cycle
0.1
Tj=25℃
0.01
0.6
0.9
1.2
1.5
1.8
Instantaneous Forward Voltage(V)
0.01
0%
20%
40%
60%
80%
100%
Percent or Rated Peak Reverse Voltage (%)
The cruve graph is for reference only, can't be the basis for judgment(曲线图仅供参考)!
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
