Decimal Decoder/Driver, TTL, CDFP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 100696816 |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | DECIMAL DECODER/DRIVER |
| MaximumI(ol) | 0.016 A |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Maximum supply current (ICC) | 41 mA |
| Prop。Delay @ Nom-Sup | 30 ns |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| S5442W/883B | S54LS42F | N74LS42FB | N7442B | S54LS42F/883B | N74LS42B | N7442F | S5442F | S54LS42W/883B | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Decimal Decoder/Driver, TTL, CDFP16 | Decimal Decoder/Driver, TTL, CDIP16 | Decimal Decoder/Driver, TTL, CDIP16 | Decimal Decoder/Driver, TTL, PDIP16 | Decimal Decoder/Driver, TTL, CDIP16 | Decimal Decoder/Driver, TTL, PDIP16 | Decimal Decoder/Driver, TTL, CDIP16 | Decimal Decoder/Driver, TTL, CDIP16 | Decimal Decoder/Driver, TTL, CDFP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknown |
| JESD-30 code | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER |
| MaximumI(ol) | 0.016 A | 0.004 A | 0.008 A | 0.016 A | 0.004 A | 0.008 A | 0.016 A | 0.016 A | 0.004 A |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | - | -55 °C | - | - | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DFP |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 41 mA | 13 mA | 13 mA | 56 mA | 13 mA | 13 mA | 56 mA | 41 mA | 13 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | NO | NO | NO | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Prop。Delay @ Nom-Sup | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | - | 30 ns |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maker | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
京公网安备 11010802033920号
EEWORLD
