FERRITE CHIP BEADS
ZA SERIES
1. PART NO. EXPRESSION :
Z A W 1 0 0 - R E -
□□
(a) (b)
(c)
(d) (e)
(f)
(a) Series code
(b) Material code
(c) Impedance code
(d) R : Reel
(e) Current code
(f) 10: Standard
11 ~ 99 : Internal control number
2. CONFIGURATION & DIMENSIONS :
A
D
B
L
G
C
PC Board Pattern
Unit:m/m
A
B
C
D
L
0.5 Ref.
G
0.20 Ref.
H
0.15~0.30
0.40± 0.02 0.20± 0.02 0.20± 0.02 0.10+0.04/-0.03
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +125° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
H
FERRITE CHIP BEADS
ZA SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
0.50
0.20
0.15~0.30
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
Note.
If Use Wave soldering is there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be unwitting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
a) Preheat circuit and products to 150° C.
d) 1.0mm tip diameter (max)
b) 350° C tip temperature for Ferrite chip bead (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
c) Never contact the ceramic with the iron tip
f) Limit soldering time to 4-5 secs.
Preheating
Soldering
20~40s
TP(26 0° C/40 s max.)
217
200
150
60~180s
25
4 80s max.
TEMPERATURE ° C
TEMPERATURE ° C
Natural
cooling
Preheating
350
Soldering
Natural
cooling
150
60~150s
Time(sec.)
Figure 1. Re-flow Soldering:3 times max
O ve r 60s.
G rad ual
Cooling
Within4 ~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP BEADS
ZA SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
Recommendable
t
Figure 3
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FPGA/CPLD
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